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Original Press Release
Plasma Etch, Inc. Eliminates Green House Gas Used In The Production of Printed Circuit Boards
Press release date: Dec 07, 2012
CFC gases are harmful to the ozone layer. It is hard to determine the exact amount of Chlorofluorocarbon’s being emitted daily, monthly or yearly by the use of plasma etching systems, however it is estimated to be a significantly substantial amount. The Magna Series Technology is a great achievement and advancement in the protection of the global environment and preservation of our ozone layer.
Specifically, the Magna Series technology eliminates the need of CF4 gases. In addition, the Magna Series technology will not require the use of O2 bottles (gas tanks) presently required. Plasma Etch also stresses the Magna Series will require significantly less power than traditional plasma etching systems currently in use.
Plasma Etch reports the Magna Series has also set new market standards in several other key areas. The new technology provides faster etch times, lower operating cost, and process uniformity not achievable using existing technologies. As news of this new technology has spread, it is being welcomed with enthusiasm and encouragement from those within the printed circuit board community and from environmental groups and governmental agencies throughout the world.
Plasma Etch, Inc. has manufactured plasma cleaning, plasma etching, and plasma surface treatment systems for over 30 years. Their plasma systems are presently used for a multitude of purposes in the printed circuit board, semiconductor, medical, electronics, R&D, laboratory, manufacturing, and life sciences markets. The company has plans of expanding and incorporating this new revolutionary technology into many of its other plasma systems which presently service this vast array of markets and applications.
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