Plasma PCB Etching System eliminates need for CF4.
Using only 3-phase power and compressed air, Magna Series provides uniform etching on both sides of panel simultaneously while eliminating need for CF4 gas, which is commonly used by PCB manufacturers plasma etching systems for desmear and etch back processing. System comprises carousel that holds eight 19 x 28 in. panels, GXS 160/1750 Boc Edwards dry pump, 2,500 W RF generator, mass flow...
Read More »SPTS Installs First Vapor HF Release Etch System in China for Shanghai Institute of Microsystem and Information Technology (SIMIT)
NEWPORT, Wales - Dry Etch Technology Deployed for MEMS Accelerometer Fabrication SEMICON China 2012 - SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has commissioned its first vapor hydrogen fluoride (VHF) etch system in China. The Primaxx-® Monarch 3 has been installed at the Shanghai...
Read More »Integrated Process Systems to Exhibit at IPC Printed Circuits Expo
Cedar City, UT -Integrated Process Systems, Inc., a leading provider of manufacturing equipment for complex multilayer printed circuit board fabrication, will exhibit a wide range of capabilities at the IPC show 2011 in Las Vegas, Nev., April 12-14. 2011. IPS will feature its popular Thin Material Transport and Fine Line Conveyor Etching Systems as well as process control software and data...
Read More »Plasma-Therm Announces VERSALINE® RIE Etch Order
St. Petersburg, FL - Plasma-Therm LLC, a global supplier of plasma etch and deposition process equipment, is pleased to announce that a leading manufacturer of high technology defense systems from the EMEA region has recently accepted delivery of a VERSALINE-® RIE etch system. This leading international manufacturer designs, develops and produces high technology defense systems for aerospace,...
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FRP Advantages for Utility Infrastructure
Our eBook, FRP Advantages for Utility Infrastructure, outlines the advantages and applications of FRP for utility structures.
Read More »University of Bergen Chooses Plasma-Therm's 790+ System for Nano-Fabrication Facility
St. Petersburg, FL - The Department of Physics and Technology at the University of Bergen, Norway, has recently selected Plasma-Therm and their 790+ Reactive Ion Etcher for its nano-fabrication facility. The University of Bergen's system addition to their facility will assist in the development of free-standing Fresnel zoneplates for neutral helium microscopes. The 790+ RIE equipment will also...
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Fiber Laser Marker delivers full 30 W of power.
Suited for installation in tight spaces, Series MD-F3000 can permanently mark and etch dense, hard metals. Unit incorporates 3-axis beam control system, which ensures distortion-free marking across full 300 x 300 mm area without mechanisms to index target or marking head. Head has fanless design and is completely sealed from dirt and dust. Additional features include internal power monitor,...
Read More »Plasma Etching System meets needs of diverse tasks.
Fully self-contained, RIE-1701 bench-top anisotropic reactive ion etch (RIE) system has automated chamber opening system and interlocked chamber enclosure that provides additional safety for those using corrosive gasses. Only vacuum pump package is external to system. Suitable plasma etching and cleaning applications include SiO2, Si3N4, and polyimide passivation removal; interlayer dielectric...
Read More »Etch System for advanced memory interconnects.
Optimized for throughput and MTBC ratings, Applied Producer-® Etch system performs interconnect dielectric etch steps needed for production of Flash and DRAM memory chips. Reactor design promotes high-throughput, high-yield dielectric etch in DRAM and NAND Flash interconnect structures from 8X-4X nm technology nodes. System is suited for chip manufacturing applications such as low k deposition,...
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Blast Cabinet features direct pressure media delivery module.
Fitted with direct pressure media delivery module, Model 8-EP is suitable for processing components with large amount of surface area and for surface treatment operations such as descaling, etching, coating removal, and surface preparation. Consisting of cyclonic separator linked to ASME-certified pressure vessel, pressure-blast module is attached to rear of blast cabinet. Most types of dry blast...
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Etching Machine delivers CD uniformity of 1 nm across wafer.
Addressing range of challenging etch applications, including high-k/metal gate, hardmask open, shallow trench isolation, and strained silicon, 2300-® Versys-® Kiyo3x Conductor Etch Series features wafer temperature control to enable radial tuning for edge control and profile shaping. It uses advanced pre-coat and post-etch chamber clean techniques. For complex film stacks such as high-k/metal...
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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.
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