Etchers

Integrated Process Systems to Exhibit at IPC Printed Circuits Expo

Cedar City, UT -Integrated Process Systems, Inc., a leading provider of manufacturing equipment for complex multilayer printed circuit board fabrication, will exhibit a wide range of capabilities at the IPC show 2011 in Las Vegas, Nev., April 12-14. 2011. IPS will feature its popular Thin Material Transport and Fine Line Conveyor Etching Systems as well as process control software and data...

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Fiber Laser Marker delivers full 30 W of power.

Fiber Laser Marker delivers full 30 W of power.

Suited for installation in tight spaces, Series MD-F3000 can permanently mark and etch dense, hard metals. Unit incorporates 3-axis beam control system, which ensures distortion-free marking across full 300 x 300 mm area without mechanisms to index target or marking head. Head has fanless design and is completely sealed from dirt and dust. Additional features include internal power monitor,...

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Plasma Etching System meets needs of diverse tasks.

Fully self-contained, RIE-1701 bench-top anisotropic reactive ion etch (RIE) system has automated chamber opening system and interlocked chamber enclosure that provides additional safety for those using corrosive gasses. Only vacuum pump package is external to system. Suitable plasma etching and cleaning applications include SiO2, Si3N4, and polyimide passivation removal; interlayer dielectric...

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Demonstration Kit has everything needed for gold etching.

GoldEX KIT(TM): Gold Etch and Recovery Sample and Demonstration Kit provides method for training centers and corporations to evaluate benefits of wet etching as well as recovery of gold. It includes samples of all components needed in both processes. Along with 3 gold-plated metal coupons, kit includes gold-plated Ti:Al substrates, cyanide-free AU1 Gold Conductor Etchant (liquid/powder),...

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XACTIX and STS Unveil Comprehensive Line of Production-Oriented Xenon Difluoride Silicon Etch Systems

Semicon West, SAN FRANCISCO, July 11 // -- Developer and producer of equipment for manufacturing micro electromechanical systems (MEMS), XACTIX, Inc., and Surface Technology Systems PLC , a leader in plasma process technologies required in the manufacturing and packaging of MEMS and advanced electronic devices, today announced that they plan to unveil a comprehensive line of production-oriented...

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Plasma Decapsulation System uses CO2 to remove fillers.

Able to process wafers as large as 200 mm, FA-2000 Fillerblast(TM) system is suited for decapsulation and depassivation of packaged devices with metallization in ICs and organic substrates in packaging. Reactive ion etcher eliminates use of wet acids. Manifold forms dry ice, which acts as fine abrasive effective in removing filler buildup, while plasma maintains constant etch rate for efficient...

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Etching System features under-the-table mount marking gun.

Etching System features under-the-table mount marking gun.

Model 7650 AirgritÂ-® Etching System marks information on glass, plastics, ceramics, and polished metals without fracturing or distorting marking surfaces. Remote marking gun can etch area of 1.75 in. diameter. System operates by blowing fine aluminum oxide grit through nozzle onto rubber mask which includes information to be marked, producing permanent and distinctive frosted or etched...

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