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Indium Corporation Features SACm(TM) at NEPCON China

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Original Press Release

Indium Corporation Features SACm(TM) at NEPCON China

Press release date: April 3, 2014

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.

SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far superior to other SAC pastes without compromising on thermal cycling – all at a cost below that of typical SAC solder paste.

SACm™ meets the electronics assembly market’s demand for a solder paste that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.

SACm™ offers superior drop test performance when compared to SAC305 and SAC105, with the added benefit of thermal cycling reliability that is equivalent to SAC305. SACm™ provides manufacturers with an affordable high-reliability SAC solder paste. This new alloy is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.

SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. Manganese provides increased strength and the reduced silver content provides a more stable cost structure, which is especially beneficial for cost-sensitive applications.

Indium Corporation will be exhibiting at booth A2-1F29 

For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACM or email sacm@indium.com

Contact:
Victoria Cruz-Griffith, Marcom Specialist
Indium Corporation
vcruz-griffith@indium.com
tel: +1.315.381.2052
34 Robinson Road
Clinton, NY  13323 USA
www.indium.com

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