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Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi

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Indium Corporation
34 Robinson Rd.
Clinton, NY, 13323
USA



Press release date: August 5, 2014

Indium Corporation will feature its new solder paste, Indium10.1, at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.

Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. Indium10.1’s exceptional soldering ability makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.

Indium10.1 offers the lowest cost of ownership to PCB assembly manufacturers through best-in-class printing and soldering performance, including industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.

Indium Corporation will be exhibiting at booth 430.

For more information about Indium10.1 or the Pb-free Solder Paste series, visit www.indium.com/solder-paste-and-powders/leading-pb-free-solder-pastes/ or email askus@indium.com.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Contact:

Anita Brown, Corporate Communications
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com
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