Company News

KLA-Tencor Corp.

One Technology Drive, Milpitas, CA, 95035, US

  • 800-600-2829

Marketing:
Meggan Powers
Sr. Director, Corporate Communications
USA
Phone: 408-875-8733
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Latest New Product News from
KLA-Tencor Corp.

Machinery & Machining Tools, Laboratory and Research Supplies & Equipment, Material Handling & Storage, Test & Measuring Instruments

Inspection System supports advanced semiconductor packaging.

April 27, 2015

Designed for characterization and monitoring of processes used in wafer-level packaging, CIRCL-AP™ enables all-surface wafer defect inspection, review, and metrology at high throughput. ICOS® T830 provides fully automated optical inspection of IC packages, leveraging sensitivity with 2D and 3D measurements to determine final package quality for diverse device types and sizes. Both systems help address such challenges as fine feature sizes and tight pitch requirements. Read More

Test & Measuring Instruments, Material Handling & Storage, Controls & Controllers, Machinery & Machining Tools

Reticle Inspection System monitors sub-20 nm design nodes.

June 2, 2014

With 193 nm illumination, Teron™ SL650 assesses incoming reticle quality, monitors degradation, and detects yield-critical reticle defects, such as haze growth or contamination. System supports mix of reticle types by using STARlightSD™ and STARlightMD™ to produce defect capture and comprehensive inspection coverage on single- and multi-die reticles, respectively. Chipmakers can also use STARlightMaps™ technology to identify CD, film thickness, anti-reflective coating, and other variations. Read More

Test & Measuring Instruments

Defect Inspection System monitors defects at optical speed.

May 7, 2013

Available for 2900 Series of defect inspection systems, NanoPoint™ focuses resources of optical inspection system on critical patterns, as identified by circuit designers or by known defect sites. During chip development, NanoPoint can reveal need for mask re-design within hours, potentially accelerating identification and resolution of design issues from months to days. During volume production, NanoPoint can selectively track defectivity within critical patterns. Read More

Test & Measuring Instruments, Laboratory and Research Supplies & Equipment

Wafer Inspection Tool targets LED and adjacent markets.

December 11, 2012

Designed for defect inspection and 2D metrology for LED applications, ICOS WI-2280 supports MEMS and semiconductor wafers spanning 2–8 in. in size. System features rule-based binning defect classification and recipe qualification engine, enabling manufacturers to optimize process control and process tool monitoring strategies. To accommodate multiple media with minimal changeover time, ICOS WI-2280 supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers. Read More

Test & Measuring Instruments

Reticle Inspection Systems cover nodes to 20 nm and beyond.

September 10, 2012

IC fab-based inspection systems X5.2(TM) and Teron(TM) 611 comprise Total ReQual(TM) solution for monitoring defectivity and pattern degradation resulting from cleaning or exposure. While sensitivity of Teron 611 is optimized for 20 nm node and beyond, X5.2 works on full mask sets at 28 nm and larger design nodes as well as 20 nm node. Both systems offer fifth-generation STARlight® inspection mode for full area coverage on multi- and single-die reticles. Read More

Test & Measuring Instruments, Machinery & Machining Tools, Laboratory and Research Supplies & Equipment

Overlay Metrology System supports multi-patterning techniques.

September 10, 2012

Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to previously-patterned features, located on either same layer or prior process layer. Read More

Test & Measuring Instruments, Material Handling & Storage, Machinery & Machining Tools, Laboratory and Research Supplies & Equipment

Wafer Inspection System detects defects on all surfaces.

May 2, 2012

Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source. Read More

Test & Measuring Instruments, Material Handling & Storage, Machinery & Machining Tools, Optics & Photonics

Wafer Defect Review System is designed for 20 nm node.

August 19, 2011

Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation system as well as reticle defect review and voltage-contrast imaging modes. Read More

Test & Measuring Instruments

Wafer Inspection System incorporates deep UV illumination.

July 19, 2011

Leveraging DUV wavelength, special apertures, and multiple illumination and collection channels, Surfscan SP3 addresses stringent 28 nm node requirements for defect detection and classification on blanket films at production speeds. System helps manufacture substrates for 28 nm devices and below that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids, or other defects that disrupt electrical integrity of transistor. Read More

Test & Measuring Instruments

Defect Analysis System is suited for PV cell manufacturers.

June 13, 2011

FabVision(TM) Solar utilizes ICOS® PVI-6 data through range of analysis and monitoring features, captures wafer/cell images and data from PVI-6, and allows navigation that simplifies image review. Users can review in-line data at any point, and reports are generated automatically with optical inspection measurement results from multiple inspection modules across multiple manufacturing lines. Rules can be configured and set by proximity, defect type, and frequency of occurrence. Read More

Test & Measuring Instruments, Laboratory and Research Supplies & Equipment

Packaged IC Component Inspector features dual taper output.

March 22, 2011

ICOS® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 µm, unit can also capture surface defects down to 40 µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm. Read More

Test & Measuring Instruments

Wafer Inspection System aids high brightness LED manufacturing.

January 26, 2011

Providing automated sub-micron defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, Candela® 8620 enables optimized quality control of both opaque and transparent substrates as well as maximum MOCVD reactor uptime and yield. Imaging and detection system optimizes signal from relevant defects-of-interest while suppressing background noise. Aided by multi-channel detection optics, system additionally allows high-purity classification of defects. Read More

Test & Measuring Instruments, Laboratory and Research Supplies & Equipment

Wafer Inspection Tool detects edge profile, metrology, defect.

September 3, 2010

Complimenting existing edge defect inspection and review functionality, capabilities of VisEdge CV300R-EP help fabs identify potentially yield-impacting irregularities in shape of wafer edge profile or edges of films deposited on wafer. Tool provides calibrated measurement of profile of wafer edge, including slope of bevel on which film edge may land. Additionally, system incorporates data from patterned edge die to trace film edge and its concentricity with wafer or neighboring films. Read More

Test & Measuring Instruments, Machinery & Machining Tools, Sensors, Monitors & Transducers, Laboratory and Research Supplies & Equipment

Film Metrology Tool aids semiconductor manufacturing.

August 12, 2010

Utilizing Patented Broadband Spectroscopic Ellipsometry, white light reflectometry, and optional UV reflectometry optics technologies, Aleris(TM) 8330 measures film thickness, refractive index, and stress of non-critical films at 32 nm node and beyond. Unit offers remote recipe management and enables recipe import from previous generation platforms. Recipe sharing among Aleris tools facilitates flexible process control strategy within fab, covering high- and low-end film applications. Read More

Test & Measuring Instruments, Material Handling & Storage

Recticle Inspector and Wafer Defect Tools aid in early detection.

July 21, 2010

TeraFab(TM)HT reticle inspector includes STARlight(TM) mode for inspection of single-die and multi-product masks and designs employing small optical proximity correction features. Model eDR-5210S e-beam wafer defect review system offers accurate wafer dispositioning using data from TeraFabHT about mask orientation and defect characteristics, and speeds review of potential defect sites. Both work with 28xx broadband wafer inspection systems and Klarity® Defect data management and analysis systems. Read More

Test & Measuring Instruments, Laboratory and Research Supplies & Equipment

Overlay Metrology System suits memory and logic devices.

July 6, 2010

Archer(TM) 300 LCM metrology system enables in-line monitoring and scanner qualification for 1Xnm half-pitch memory and 2Xnm logic technologies. Unit is able to accurately measure overlay error on double-patterning and other challenging layers, and uses double patterning lithography to reduce tolerable error to just few nanometers at 32 nm node. It meets strict specifications required to qualify scanners and control high-volume manufacturing of logic and memory devices. Read More

Software

Virtual Lithography Tool addresses EUV and DPL challenges.

February 24, 2010

PROLITH(TM) X3.1 lets researchers troubleshoot issues in EUV and double patterning lithography (DPL) processes, including line edge roughness (LER) and patterning issues associated with wafer topography. First-principle physics help investigate and optimize lithography processes by simulating patterning results. While stochastic model takes into account quantum behavior of light and discrete reactant molecules in resist, photoelectron model simulates outcome of EUV lithography processes. Read More

Test & Measuring Instruments, Laboratory and Research Supplies & Equipment

LED Wafer Inspector optimizes throughput and accuracy.

December 8, 2009

Featuring automated optical inspection capabilities, ICOS® WI-2250 fosters transition to larger LED and MEMS wafer sizes for manufacturers. It allows for defect inspection of whole and diced wafers up to 200 mm, with macro inspection sensitivity in pre- and post-dice inspection of high-brightness LEDs and MEMS wafers. Rule-based binning lends to real-time defect classification, advanced metrology capabilities, and optimal throughput. Read More

Test & Measuring Instruments, Laboratory and Research Supplies & Equipment

Metrology System measures multi-layer film thickness.

March 3, 2008

Suited for production monitoring of critical gate applications on product wafers and 45/32 nm development, Aleris 8500 combines composition and multi-layer film thickness metrology. It is built on SpectraFx 200 technology featuring 150 nm Broadband Spectroscopic Ellipsometry (BBSE(TM)) optics. Single-tool solution comes with StressMapper(TM) module that provides high spatial resolution for production monitoring of 2D stress in high-stress films. Read More

Software

Metrology Software verifies plasma etch chamber health.

January 14, 2008

Used with SensArray wafer-level metrology tools, PlasmaWafer Suite provides chipmakers and etch equipment suppliers with measurement capability to help verify plasma etch chamber health and identify problems such as drift, non-uniformity, and slight differences in chamber matching. Suite includes PlasmaSuite diagnostic module with statistical process control (SPC), subsystem-level troubleshooting, and detailed characterization of critical process parameters. Read More

Other Company News from
KLA-Tencor Corp.