Company News

KLA-Tencor Corp.

One Technology Drive, Milpitas, CA, 95035, US

  • 408-875-3000
  • 800-600-2829

Marketing:
Meggan Powers
Sr. Director, Corporate Communications
USA
Phone: 408-875-8733
E-mail this person

Share Like Tweet Add Email

Latest New Product News from
KLA-Tencor Corp.

Material Handling & Storage, Controls & Controllers, Test & Measuring Instruments, Machinery & Machining Tools

Reticle Inspection System monitors sub-20 nm design nodes.

June 2, 2014

With 193 nm illumination, Teron™ SL650 assesses incoming reticle quality, monitors degradation, and detects yield-critical reticle defects, such as haze growth or contamination. System supports mix of reticle types by using STARlightSD™ and STARlightMD™ to produce defect capture and comprehensive inspection coverage on single- and multi-die reticles, respectively. Chipmakers can also use STARlightMaps™ technology to identify CD, film thickness, anti-reflective coating, and other variations. Read More

Test & Measuring Instruments

Defect Inspection System monitors defects at optical speed.

May 7, 2013

Available for 2900 Series of defect inspection systems, NanoPoint™ focuses resources of optical inspection system on critical patterns, as identified by circuit designers or by known defect sites. During chip development, NanoPoint can reveal need for mask re-design within hours, potentially accelerating identification and resolution of design issues from months to days. During volume production, NanoPoint can selectively track defectivity within critical patterns. Read More

Laboratory and Research Supplies & Equipment, Test & Measuring Instruments

Wafer Inspection Tool targets LED and adjacent markets.

December 11, 2012

Designed for defect inspection and 2D metrology for LED applications, ICOS WI-2280 supports MEMS and semiconductor wafers spanning 2–8 in. in size. System features rule-based binning defect classification and recipe qualification engine, enabling manufacturers to optimize process control and process tool monitoring strategies. To accommodate multiple media with minimal changeover time, ICOS WI-2280 supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers. Read More

Machinery & Machining Tools, Laboratory and Research Supplies & Equipment, Test & Measuring Instruments

Overlay Metrology System supports multi-patterning techniques.

September 10, 2012

Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to previously-patterned features, located on either same layer or prior process layer. Read More

Test & Measuring Instruments

Reticle Inspection Systems cover nodes to 20 nm and beyond.

September 10, 2012

IC fab-based inspection systems X5.2(TM) and Teron(TM) 611 comprise Total ReQual(TM) solution for monitoring defectivity and pattern degradation resulting from cleaning or exposure. While sensitivity of Teron 611 is optimized for 20 nm node and beyond, X5.2 works on full mask sets at 28 nm and larger design nodes as well as 20 nm node. Both systems offer fifth-generation STARlight® inspection mode for full area coverage on multi- and single-die reticles. Read More

Material Handling & Storage, Machinery & Machining Tools, Laboratory and Research Supplies & Equipment, Test & Measuring Instruments

Wafer Inspection System detects defects on all surfaces.

May 2, 2012

Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source. Read More

Material Handling & Storage, Machinery & Machining Tools, Test & Measuring Instruments, Optics & Photonics

Wafer Defect Review System is designed for 20 nm node.

August 19, 2011

Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation system as well as reticle defect review and voltage-contrast imaging modes. Read More

Test & Measuring Instruments

Wafer Inspection System incorporates deep UV illumination.

July 19, 2011

Leveraging DUV wavelength, special apertures, and multiple illumination and collection channels, Surfscan SP3 addresses stringent 28 nm node requirements for defect detection and classification on blanket films at production speeds. System helps manufacture substrates for 28 nm devices and below that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids, or other defects that disrupt electrical integrity of transistor. Read More

Other Company News from
KLA-Tencor Corp.