KLA-Tencor Corp.
Milpitas, CA 95035
CD Metrology System aids 90 and 65 nm IC manufacturing.
SpectraCD-XT provides inline CD and profile measurements of critical device structures that help enable early prediction of IC performance and yield at 90 and 65 nm nodes. Suited for high-volume IC manufacturers, this spectroscopic ellipsometry-based CD metrology tool features sub-2 sec move-acquire-measure time and throughput rated up to 100+ wph. Optics use oblique illumination, enabling...
Read More »E-Beam Inspection System handles nodes 65 nm and smaller.
Helping identify and overcome front-end-of-line (FEOL) issues in integrating NiSi and strained silicon into devices, eS32 e-beam inspection platform enables capture of subtle electrical and small physical defects at 65 and 45 nm nodes. It facilitates detection and resolution of systematic, yield-limiting defects in FEOL and back-end-of-line (BEOL) applications. Product also captures slight...
Read More »System provides lithography-aware design inspection.
Suited for 90 nm and below designs where lithography process windows are extremely small, DesignScan enables inline inspection of post-RET reticle designs for errors through process window. It lets users identify and optimize design-related performance and yield-limiting patterns before committing design to mask production. DesignScan inspection can be run across full process window at...
Read More »Fly-Height Tester is suited for HDD manufacturers.
Designed for data storage industry, D6 fly-height metrology system uses laser-based phase interferometer to test down to contact with precision within 0.15 nm and matching within 0.64 nm. Multiple signals are used to directly discern differential phase of light reflected off recording head surface without need for calibrating intensity envelope of interference fringes. Measurement principle...
Read More »Software optimizes wafer design for manufacturability.
PROLITH v9.0 helps optimize mask designs and lithography processes for design for manufacturability (DFM). It also helps predict manufacturability of extreme resolution enhancement techniques using multi-algorithm simulations that take minutes to complete. Mask Defect option enables users to determine printability of mask defects and their impact on process windows. Users can also simultaneously...
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