Steppers

Canon Releases FPA-5520iV HR Option Steppers That Automatically Detects the Alignment Marks of Chips
Steppers

Canon Releases FPA-5520iV HR Option Steppers That Automatically Detects the Alignment Marks of Chips

The FPA-5520iV HR Option Stepper is designed for back-end semiconductor lithography processes. The product uses FOWLP technology for handling extremely warped reconstituted wafers. The unit is equipped with a projection optical system that offers a resolution of 0.8 um for finer circuit patterning. The Stepper comes with enhanced functionality such as Fan-Out Wafer Level Packaging and increased...

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Lasers

KrF Excimer Laser Stepper prepares for expanding IoT market.

Used for production of analog semiconductors, sensors, and communication devices, FPA-3030EX6 accommodates various substrates with diameters of 200 mm or less. machine also also offers compatibility with special substrates used in the fabrication of diverse devices to meet semiconductor manufacturers' needs.

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Lithography Equipment

Ultratech Receives Large Multiple System Order for Fan-Out Wafer-Level Packaging Application

Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application SAN JOSE, Calif.,Â- – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser­-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems,...

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Miscellaneous Lifts

Vertical Lift Stage is designed for vertical lifting.

As stepper actuator-driven platform capable of movingÂ- 10 kg load, VSR Series offers 20 mm travel and 10 kg load capacity, as well as 20 kg peak thrust. Stage measures 55 mm tall when retracted and has footprint which allows direct mounting onto Zaber linear stages for multi-axis configurations. Able to reach speeds up to 45 mm/sec, product is designed for plug-and-play use...

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Laser Cutting Services

SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM Berlin

Garching – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is...

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Steppers

Environment Friendly Laser Processing in Advanced Packaging Gains Pace - Leading US-American IDM Places Order for Excimer Laser Ablation Tool

Garching - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has received a purchase order for their latest generation laser ablation stepper from a leading US-American IDM (Integrated Device Manufacturer). This important sale re-states the increasing importance of this technology in advanced packaging, adding to the recent shipments...

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AutomationDirect Adds Low-Cost Microstepping Drive and Accessories to SureStep Line
Stepper Motor Controllers and Drives

AutomationDirect Adds Low-Cost Microstepping Drive and Accessories to SureStep Line

AutomationDirect's SureStep line of motion control products now includes a low cost of entry digital stepper drive in a compact package. The standard stepper drive operates with high-speed pulse input signals (Step and Direction, or jumper-selectable CW/CCW step) and has a selectable resolution range of 200 to 20,000 steps per revolution. Additional features include a switch-selectable automatic...

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Lithography Equipment

UV-NIL Step and Repeat System is designed for accuracy.

UV-nanoimprint lithography (UV-NIL) step and repeat system, EVG770 Gen II NIL Stepper, incorporates abilities that promote process reliability, accuracy, and pattern fidelity at decreasing feature densities. While vacuum imprinting on spun-on polymer layer eliminates defect issues caused by trapped air bubbles, optical sensors align stamp and wafer into perfect parallelism for contact-free wedge...

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Steppers

Stepper suits advanced-packaging applications.

Saturn Spectrum 300e(2) stepper, offers dual-lamp illumination option, which provides wafer-plane irradiance (>3400 mW/cmÂ-²) and throughput while exposing thick resists. Its edge processing capabilities provide edge-exposure and exclusion capability to deliver yield, imaging, and throughput performance required for flip-chip and wafer-level packaging (WLP) applications. Stepper also uses...

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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
Sponsored

Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber

Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.

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