Stepper suits advanced-packaging applications.

Press Release Summary:



Saturn Spectrum 300e(2) stepper, offers dual-lamp illumination option, which provides wafer-plane irradiance (>3400 mW/cm²) and throughput while exposing thick resists. Its edge processing capabilities provide edge-exposure and exclusion capability to deliver yield, imaging, and throughput performance required for flip-chip and wafer-level packaging (WLP) applications. Stepper also uses pattern-recognition-based alignment techniques.



Original Press Release:


Ultratech Stepper Unveils Saturn Spectrum 300e(2) for Advanced-Packaging Lithography


With New High-Power Illumination and Edge-Processing Capabilities, Ultratech's Newest Bump Stepper Alleviates Key Photoresist-Exposure Challenges, Resulting In Superior Performance and Throughput

SEMICON West 2002, SAN JOSE, Calif., July 11 /PRNewswire-FirstCall/ -- Ultratech Stepper, Inc. (Nasdaq: UTEK), a leading supplier of photolithography systems used to manufacture semiconductors and nanotechnology devices, today launched the Saturn Spectrum 300e(2) -- the newest addition to Ultratech's family of steppers for advanced-packaging applications. Ultratech's newest stepper was developed in response to the growing need for thick photoresist-exposure capabilities in 300 mm bump applications. The Saturn Spectrum 300e(2) features a new dual-lamp illumination option and edge processing capabilities designed specifically to deliver the superior yield, imaging and throughput performance required for today's advanced flip-chip and wafer-level packaging (WLP) applications.

Ultratech's Saturn Spectrum 300e(2) builds on the productivity and ease-of-use benefits of the company's Saturn Spectrum 300, incorporating key new features designed specifically to address advanced-packaging market requirements for the 300 mm era. The new dual-lamp illumination option provides significantly higher wafer-plane irradiance (>3400mW/cm2) and throughput while exposing thick resists. The systems edge-processing option provides both edge-exposure and exclusion capability to ensure the outer edge of the wafer is processed as needed and to maintain optimum throughput. Pattern-recognition-based alignment techniques enable the Saturn Spectrum 300e(2) to provide significantly better alignment performance than that offered by contact and proximity aligners. The superior technical capabilities of the Saturn Spectrum 300e(2) stepper, along with its high-yield and cost-of-ownership advantages, are designed to make it an intelligent low-risk lithography solution for the advanced-packaging market.

"We developed the Saturn Spectrum 300e(2) to address our advanced-packaging customers' stringent yield, imaging performance and throughput requirements," said Arthur W. Zafiropoulo, Ultratech chairman, president and CEO. "We are an industry leader in developing innovative new wafer bumping technologies, and with the Saturn Spectrum 300e(2) in our bump-stepper arsenal, our customers can now choose from what we believe to be the industry's most comprehensive offering of lithography solutions for 150-, 200- and 300-mm advanced-packaging manufacturing environments."

Ultratech's line of advanced-packaging products will be on display in its booth #2516 at the front-end segment of SEMICON West, July 22-24, at the Moscone Center in San Francisco. As a founding member of the Advanced Packaging and Interconnect Alliance (APiA), Ultratech's VP of Worldwide Sales, Erik Smith, will give the opening remarks for the APiA seminar to be held July 18, at the Fairmont Hotel in San Jose.

About Ultratech: Founded in 1979, Ultratech Stepper, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices. The company produces products designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at www.ultratech.com

CONTACT: Bruce R. Wright, Senior Vice President & CFO, or Laura Rebouche, Vice President, Investor Relations and Corporate Communications, lrebouche@corp.ultratech.com, both of Ultratech Stepper, Inc., +1-408-321-8835, or fax, +1-408-577-3379

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