Open Automation in The Integrated Smart Factory

Open Automation in The Integrated Smart Factory

Suwanee, Georgia (USA), January 19, 2023 – The SMT Solutions division of market leader ASMPT will once again demonstrate its position as the industry’s technology pioneer at booth 1701 at the IPC APEX Expo 2023 from January 24 to 26 in San Diego. Among the exhibits will be new DEK TQ L solder paste printer for large circuit boards measuring up to 600 by 510 millimeters and innovative software...

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New CAN Isolator for Fast Bidirectional Data Exchange

New CAN Isolator for Fast Bidirectional Data Exchange

AX021910 is designed for versatile control of up to four proportional outputs to directly drive coils or other loads. AX180800 provides the temperature information to the engine control system. Monitors exhaust temperature, winding temperature and fluid temperature.

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New Desktop 3D Printer Is Ready To Print Out Of The Box

New Desktop 3D Printer Is Ready To Print Out Of The Box

Available in two build volume sizes to meet your printing needs. The TAZ SideKick 289 delivers a build volume of 162mm x 162mm x 181mm and the TAZ SideKick 747 delivers 231mm x 231mm x 248mm . Able to print freely at a variety of layer height resolutions eliminating Z banding or Z wobble issues .

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New SmartLF SGi Scanner with CCD Technology

New SmartLF SGi Scanner with CCD Technology

Features true color, good size accuracy and designed for high volume. Captures defined detail sharply on technical drawings and maps, as well as vibrant, accurate colors needed by graphics. Scan documents up to 44 wide and 15 mm thick.

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Interface Masters Selects Marvell® OCTEON TX2® ARM64 Processor Technology for Tahoe 8830 Networking Appliance

Interface Masters Selects Marvell® OCTEON TX2® ARM64 Processor Technology for Tahoe 8830 Networking Appliance

Enterprise-ready Tahoe 8830 1U Networking Appliance San Jose, CA – February 18, 2021 – Interface Masters introduces Tahoe 8830, a 1U networking appliance for enterprise applications, and the newest addition to their family of ARM-based solutions. Selecting the industry-leading Marvell OCTEON TX2 CN9880 processor with 36-core ARM64 processor technology for the final design set the stage for...

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New i-line Stepper System for High-density Packaging

New i-line Stepper System for High-density Packaging

FPA-5520iV LF features 1.5 micrometer resolution and a wide exposure field of 52 mm x 68 mm. Offers wide exposure field of circuit patterns to meet packaging needs including heterogeneous integration. Redistribution layer patterns can be exposed with a high resolution of 1.0 micrometers.

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Precision Machined Parts for High Tech Applications
Sponsored

Precision Machined Parts for High Tech Applications

For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.

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