Parker Announces Switch to Chromium-6 Free Plating for Metal Products, Resulting in a Technically Superior Plating that is More Environmentally Friendly
WICKLIFFE, Ohio, July 24, 2006 - The Hose Products Division of Parker Hannifin today announced that it will be changing its plating to a process that no longer uses hexavalent chromium (Cr6), a substance that has been deemed environmentally hazardous. In its ongoing efforts to produce more environmentally friendly products and comply with EU restrictions on the use of hexavalent chromium in...
Read More »Flip Chip is designed for wafer bumping applications.
EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...
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A Reference Guide To Frequency Conversion Power Supplies For Industrial Applications
The purpose of this guide is to assist contractors and purchasing agents charged with writing specifications for, and/or procuring, frequency converters.
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Precision Machined Parts for High Tech Applications
For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.
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