Synova and DISCO HI-TEC EUROPE to Co-Develop Hybrid Dicing Tool
Fusion of DISCO's Blade Saw With Synova's Water Jet-Guided Laser Technology to Yield Revolutionary Hybrid Dicing Solution LAUSANNE, Switzerland and MUNICH, Germany, June 11 // -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of...
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ChromaDice(TM) IX-300 UV Laser Wafer Processing System features ProtectoLEDÃ-® Technology, which is based on water-soluble protective coating that prevents contamination of wafer during dry-etch process. Utilizing UV-DPSS laser technology at 355 or 266 nm wavelengths, system operates at cut rates up to 150 mm/sec on GaAs wafers, with kerf widths down to 2.5 Ã-µm.
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This white paper provides an overview into EMI/RFI shielding considerations for electric vehicles.
Read More »Standex Engraving Mold-Tech Offers Nickel Shell Capabilities on a Global Scale
Standex Engraving Mold-Tech is the premier, global supplier for mold texturing and surface finishing. With a full range of services, Standex Engraving Mold-Tech is also the only nickel shell supplier producing in three global locations. See our video to learn more.
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