Tin Etch Resist suits tank or flood systems.
Share:
Press Release Summary:
TINCOTE 333 immersion tin etch resist replaces electroplated tin or tin/lead in Chemelex line of printed circuit chemistry. It produces flat, uniform deposit thickness, and may be replenished with tin and stabilizer components TINCOTE 333-S and TINCOTE 333-T.
Original Press Release:
Immersion Tin Etch Resist Added to Chemelex® Line
Milwaukee, WI...TINCOTE 333, an immersion tin etch resist to replace electroplated tin or tin/lead, was recently added to the Chemelex line of printed circuit chemistry.
TINCOTE 333 produces a flat, uniform deposit thickness that strips quickly for faster throughput and can be used in either tank or flood systems. It is easily replenished with tin and stabilizer components, TINCOTE 333-S AND TINCOTE 333-T.
Chemelex is a division of RBP Chemical Technology, an ISO 9001 certified company that has been a leader in serving the printed circuit board industry for more than 25 years.
For more information on these, or other Chemelex products call 800-558-0747 or visit our web site at www.rbpchemical.com.