Thin Film Technology (a Subsidiary of Williams Advanced Materials) Introduces Its Visi-Lid(TM), an Optical Window Assembly, to the European Market
Thin Film Technologies (TFT) a subsidiary of Williams Advanced Materials
(WAM) will be debuting its Visi-lid(TM) product line to the European market place during the Night Vision exhibition in London, November 1- 2 2006.
Visi-Lids(TM) provide an integrated approach for hermetically sealing optoelectronic devices. TFT and WAM offer a unique set of capabilities that include: thin film optical coatings, precision machining & soldering technology provides a turn key solution to complicated packaging requirements.
Engineering support for Visi-Lids(TM) is provided from design through final assembly. A large array of materials options is available, from glass, and quartz, to silicon, germanium, and sapphire windows. Coating capabilities range from Visible, through Long Wave Infra-red. Solderable seal rings can be provided for seam seal or solder seal assembly.
Night Vision, Thermal Imaging Devices and Optical Switches are a few of the technologies currently employing the Visi-Lids(TM) product line. TFT will also be exhibiting their Thin Film Coating and custom Hybrid Circuit capabilities. Visit booth 34 to learn more.
For specific inforamtion about Visi-Lids(TM) go to http://www.williams-adv.com/packagingMaterials/visilids.php
Lisa A. Bruce
Marketing Coordinator
Williams Advanced Materials
2978 Main Street, Buffalo NY 14214
(716) 837-1000
