Materion Advanced Materials Group

Thin Film Technology (a Subsidiary of Williams Advanced Materials) Introduces Its Visi-Lid(TM), an Optical Window Assembly, to the European Market

Thin Film Technology (a Subsidiary of Williams Advanced Materials) Introduces Its Visi-Lid(TM), an Optical Window Assembly, to the European Market

Thin Film Technologies (TFT) a subsidiary of Williams Advanced Materials (WAM) will be debuting its Visi-lid(TM) product line to the European market place during the Night Vision exhibition in London, November 1- 2 2006. Visi-Lids(TM) provide an integrated approach for hermetically sealing optoelectronic devices. TFT and WAM offer a unique set of capabilities that include: thin film optical...

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Copper Alloy copes with demanding applications.
Materials

Copper Alloy copes with demanding applications.

ToughMetÂ-® consists of spinodal alloy of copper with 15% nickel and 8% tin. It exhibits stength 3 times greater than copper, yet possesses tribological properties comparable to bronze. Inherent lubricity means that bushings are unlikely to fail even if starved of lubricant. ToughMet is suitable for low speed, high load and high speed, low load applications, with continuous rotary or...

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Company News

Williams Advanced Materials Inc. to Meet Increased Demand for Fab Services with New Facility in the Czech Republic

Buffalo, New York - June 6, 2007 - Williams Advanced Materials (WAM), a leading global materials and services company, announced today an expansion of its operations into Europe with the opening of a new precision cleaning and reconditioning services facility in the Czech Republic. The expansion represents another major step in WAM's global strategy to support physical vapor deposition (PVD)...

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Thin Film Technology (a Subsidiary of Williams Advanced Materials) Introduces Its Visi-Lid(TM), an Optical Window Assembly, to the European Market

Thin Film Technology (a Subsidiary of Williams Advanced Materials) Introduces Its Visi-Lid(TM), an Optical Window Assembly, to the European Market

Thin Film Technologies (TFT) a subsidiary of Williams Advanced Materials (WAM) will be debuting its Visi-lid(TM) product line to the European market place during the Night Vision exhibition in London, November 1- 2 2006. Visi-Lids(TM) provide an integrated approach for hermetically sealing optoelectronic devices. TFT and WAM offer a unique set of capabilities that include: thin film optical...

Read More »
Company News

Williams Advanced Materials Announces Major Expansion of Chamber Services In Buffalo

BUFFALO, New York - May 12, 2006 - Williams Advanced Materials Inc. (WAM) announced today a major expansion of thin film chamber services at its Buffalo, New York facility. Chamber services is an expanding part of WAM's total service element for its physical vapor deposition (PVD) base. The expansion, which includes new capital equipment, will more than double the company's current chamber...

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Copper Alloy copes with demanding applications.
Materials

Copper Alloy copes with demanding applications.

ToughMetÂ-® consists of spinodal alloy of copper with 15% nickel and 8% tin. It exhibits stength 3 times greater than copper, yet possesses tribological properties comparable to bronze. Inherent lubricity means that bushings are unlikely to fail even if starved of lubricant. ToughMet is suitable for low speed, high load and high speed, low load applications, with continuous rotary or...

Read More »

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