Master Bond Inc. announces the successful culmination of in use trial testing for EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating, and encapsulation. The cured compound exhibits a high, 31% elongation, truly exceptional for a thermal conductive epoxy where the conductivity is a robust 2.6 W/moÂ°K (18 BTUoin/ft2ohroÂ°F). As very little exotherm is developed during cure, EP21TDC-2AN is suitable for potting and encapsulation in very thick as well as thin sectioned configurations. This versatile epoxy resin compound exhibits superior tensile shear of over 1070 psi together with excellent peel strength greater than 15 pli. Trial results show it being successfully employed in a number of demanding aerospace and chemical industry applications. In these trials it has shown improved long term performance over various other flexible compounds such as polysulfide compositions over a wide service temperature range starting from -185Â°C and going up to 120Â°C (-300Â°F to 250Â°F). As such, EP21TDC-2AN is also recommended for cryogenic applications. Due to its excellent flexibility, it is superb for bonding substrates with greatly differing coefficients of expansion.
Master Bond EP21TDC-2AN produces durable high quality bonds to many different substrates including metals, glass, ceramics, wood, vulcanized rubber and many plastics. The hardened composition is a good electrical insulator with a volume resistivity of greater than 1012 ohm cm. In addition to high elongation and peel strength it has excellent thermal shock and chemical resistance including exposure to erosion from water, gasoline and numerous acids, bases and salts. EP21TDC-2AN can also be widely used in electronics, electrical, computer, metalworking, appliance, automobile and chemical industries. It is available in premixed bi-packs and cartridge/gun packaging for convenient dispensing as well as in pint, quart, gallon and 5 gallon container kits.