SAN JOSE, Calif., Nov. 28, 2018 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter wafers. This conversion is taking place because –
- Industry is better able to handle 8" wafers for bumping, thinning, and sawing
- Number of available Unit Cells per wafer is more than doubled
- Wafers can be offered up to 725µm thick to better simulate application chips
- The larger wafer produces more large cell array chips
- Cost per Unit Cell is lowered
For a limited time, TEA is accepting preorders for the 8" wafer products – both TTC-1001 (1mm x 1mm Unit Cell) and TTC-1002 (2.54mm x 2.54mm Unit Cell) versions – and is offering a price discount on orders of 5 or more wafers of either version. Both versions will be available in Wire Bond or Flip Chip (Bumped) types. Initial delivery is scheduled for February 2019.
About Thermal Engineering Associates:
TEA and its president, Bernie Siegal, have been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field.
CONTACT: Bernie Siegal, email@example.com, (650) 924-0515