Thermal Engineering Associates, Inc
Mountain View, CA 94043
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Thermal Test Chip meets JEDEC standards.
TTC-1002 Thermal Test Chips deliver precise thermal loads to specific geographic areas of semiconductor package or PCB to simulate thermal performance characteristics of subsystem. Cell, which measures 2.5 x 2.5 mm, may be used individually or combined in matrix of up to 40 x 40. There is always periphery access for all heating and Kelvin enabled measurement connections, and strategically placed...
Read More »TEA Partners with Packaging Services Firm
PACKAGE SCIENCE SERVICES WILL BENEFIT TEA CUSTOMERS SANTA CLARA, Calif., Jan. 11, 2011 - Thermal Engineering Associates (TEA) announced today that it is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. Our mission is to provide best-in-class package engineering services from...
Read More »Thermal Test Chip meets JEDEC standards.
TTC-1002 Thermal Test Chips deliver precise thermal loads to specific geographic areas of semiconductor package or PCB to simulate thermal performance characteristics of subsystem. Cell, which measures 2.5 x 2.5 mm, may be used individually or combined in matrix of up to 40 x 40. There is always periphery access for all heating and Kelvin enabled measurement connections, and strategically placed...
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