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Thermal Engineering Associates, Inc

Thermal Test Chip Wafers to be Available in 8
Agricultural & Farming Products

Thermal Test Chip Wafers to be Available in 8

SAN JOSE, Calif., Nov. 28, 2018 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8 (200mm) diameter wafers. This conversion is taking place because – Industry is better able to handle 8 wafers for bumping, thinning, and sawing Number of available Unit Cells per wafer is more than doubled Wafers...

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Test & Measurement

TMS-5000 Thermal Measurement System can be controlled with USB.

Available in TTV-410X, the TMM-100 variants, TMS-5000 Thermal Measurement System comes with software program for controlling of diode calibration, automated measurement, temperature sensing and data logging. TTV-410X Thermal Test Vehicle is designed in two sizes of Thermal Test Chip mounted on backing plate heat spreader plate and heat sink. TMM-100 Thermal Measurement Module can read up to 8...

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Health, Medical, & Dental Supplies and Equipment

Temperature Measurement Instrument accepts variety of sensors.

Supporting thermal evaluation and testing applications, self-contained Model TMM-100 has 8 channels for measuring diode voltage used in temperature measurements as well as 2 integrated Type-T thermocouple measurement circuits and two 10 KΩ NTC thermistor measurement circuits. USB-connected instrument is supplied with Windows™ 7, 8, and 10 compatible software that provides for sensor...

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Electrical Equipment & Systems

Thermal Engineering Associates Lowers the Cost of Thermal Testing

More New Thermal Interface Material Characterization Tools SANTA CLARA, Calif., -- Thermal Engineering Associates, Inc. (TEA) announces the availability of a new family of Thermal Interface Material (TIM) characterization tools that offer flexibility, standardization, and low cost. The tools are comprised of the popular TEA Thermal Test Chip (TTC) in sizes ranging from 2.5mm square to 12.8mm...

Read More »
Materials

TIM Characterization Tools come in various sizes, package types.

Thermal Interface Material (TIM) characterization tools comprise Thermal Test Chips (TTCs) in sizes from 2.5–12.8 mm-² mounted on- various packages, including BGA, QFN, and DIP. These tools, which include TTV-1100/1200/1500/1800/3000/3100 Series, can also be used to simulate heat sources for validation of thermal simulation, quantify thermal management performance, and establish...

Read More »
Electrical Equipment & Systems

Thermal Test Chip meets JEDEC standards.

TTC-1002 Thermal Test Chips deliver precise thermal loads to specific geographic areas of semiconductor package or PCB to simulate thermal performance characteristics of subsystem. Cell, which measures 2.5 x 2.5 mm, may be used individually or combined in matrix of up to 40 x 40. There is always periphery access for all heating and Kelvin enabled measurement connections, and strategically placed...

Read More »
Thermal Test Chip Wafers to be Available in 8
Agricultural & Farming Products

Thermal Test Chip Wafers to be Available in 8

SAN JOSE, Calif., Nov. 28, 2018 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8 (200mm) diameter wafers. This conversion is taking place because – Industry is better able to handle 8 wafers for bumping, thinning, and sawing Number of available Unit Cells per wafer is more than doubled Wafers...

Read More »
Test & Measurement

TMS-5000 Thermal Measurement System can be controlled with USB.

Available in TTV-410X, the TMM-100 variants, TMS-5000 Thermal Measurement System comes with software program for controlling of diode calibration, automated measurement, temperature sensing and data logging. TTV-410X Thermal Test Vehicle is designed in two sizes of Thermal Test Chip mounted on backing plate heat spreader plate and heat sink. TMM-100 Thermal Measurement Module can read up to 8...

Read More »
Health, Medical, & Dental Supplies and Equipment

Temperature Measurement Instrument accepts variety of sensors.

Supporting thermal evaluation and testing applications, self-contained Model TMM-100 has 8 channels for measuring diode voltage used in temperature measurements as well as 2 integrated Type-T thermocouple measurement circuits and two 10 KΩ NTC thermistor measurement circuits. USB-connected instrument is supplied with Windows™ 7, 8, and 10 compatible software that provides for sensor...

Read More »
Electrical Equipment & Systems

Thermal Engineering Associates Lowers the Cost of Thermal Testing

More New Thermal Interface Material Characterization Tools SANTA CLARA, Calif., -- Thermal Engineering Associates, Inc. (TEA) announces the availability of a new family of Thermal Interface Material (TIM) characterization tools that offer flexibility, standardization, and low cost. The tools are comprised of the popular TEA Thermal Test Chip (TTC) in sizes ranging from 2.5mm square to 12.8mm...

Read More »
Materials

TIM Characterization Tools come in various sizes, package types.

Thermal Interface Material (TIM) characterization tools comprise Thermal Test Chips (TTCs) in sizes from 2.5–12.8 mm-² mounted on- various packages, including BGA, QFN, and DIP. These tools, which include TTV-1100/1200/1500/1800/3000/3100 Series, can also be used to simulate heat sources for validation of thermal simulation, quantify thermal management performance, and establish...

Read More »
Company News

TEA Partners with Packaging Services Firm

PACKAGE SCIENCE SERVICES WILL BENEFIT TEA CUSTOMERS SANTA CLARA, Calif., Jan. 11, 2011 - Thermal Engineering Associates (TEA) announced today that it is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. Our mission is to provide best-in-class package engineering services from...

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Electrical Equipment & Systems

Thermal Test Chip meets JEDEC standards.

TTC-1002 Thermal Test Chips deliver precise thermal loads to specific geographic areas of semiconductor package or PCB to simulate thermal performance characteristics of subsystem. Cell, which measures 2.5 x 2.5 mm, may be used individually or combined in matrix of up to 40 x 40. There is always periphery access for all heating and Kelvin enabled measurement connections, and strategically placed...

Read More »

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