Press Release Summary:
Micro system is offered with thermal imaging camera featuring 320 x 240 element, uncooled detector; 0.05Â°C sensitivity; 20 Âµm microscopic lens; wide-angle lens; and 16-bit digital Camera Link interface. Additionally, system elements include tower computer and monitor, vertical camera stage, xy table, thermal chuck with controller, and I/O relay module. System is suited for semiconductor failure analysis as well as calculating thermal resistance and identifying die bond defects.
Original Press Release:
Camera Upgrade for Micro Thermal Imaging System
The latest version of the Micro thermal imaging system for semiconductor failure analysis includes a new thermal imaging camera with 320x240 element uncooled detector and 0.05°C sensitivity, 20 µm microscopic lens, wide angle lens, and 16 bit digital Camera Link interface.
As electronic devices continue to decrease in size, heat generation and thermal dissipation become increasingly important. Micro can measure and display the temperature distribution over the surface of semiconductor devices, enabling quick detection of hot areas which can decrease efficiency and frequently lead to early failure. Additional applications include calculating thermal resistance, measuring junction temperature, and identifying die bond defects.
A complete Micro system includes thermal imaging camera, tower computer and monitor, mounting platform, vertical camera stage, xy table, thermal chuck with controller, and I/O relay module.