Press Release Summary:
RF high-frequency CSP/BGA test sockets have spring probe contacts that provide 500,000+ insertion/withdrawal cycles with no loss of contact force or increase in contact resistance. Sockets offer short signal paths of 0.098 in. for 1.00 mm and 1.27 mm pitch packages. Self-inductance of sockets is 0.62 nH and contact resistance is 30m Ohms after 500,000 cycles. Propagation delay is 45 psec and capacitance is 0.45 pF.
Original Press Release:
Aries Introduces High Frequency Test Sockets For 0.5mm Through 1.27mm Pitch CSP/BGA Devices
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced the development and availability of RF test sockets for CSP/BGA devices with 0.5mm through 1.27mm pitch.
The new high frequency CSP/BGA test socket combines outstanding electrical characteristics, high reliability contacts and exceptionally long cycle life. The high performance spring probe contact provides more than 500,000 insertion/withdrawal cycles with no loss of contact force or increase in contact resistance.
For optimum performance, the new Aries socket offers a short signal path of only .098" (2.49 mm) for 1.00mm and 1.27mm pitch packages. Self-inductance of the socket is just .62nH and contact resistance is 30m Ohms after 500,000 cycles. Propagation delay is only 45 picoseconds and capacitance is 0.45 picoFarads. Contact force is 30 grams at an operating position of 0.98".
Both hinged sockets for manual applications and sockets with double-latched lids for automated operation are available.
Socket materials are: Torlon or PEEK body; gold-plated spring probe; and stainless steel hardware.
Pricing for a 289-position BGA, four-piece quantity, is $2,553 each. Delivery is 6 weeks ARO.