Solder Paste eliminates tombstone defects.

Press Release Summary:



Loctite® Multicore® 63S4 RP15 phased-reflow, no clean solder paste is formulated with 63S4 alloy. 63S4 alloy blends SN63 and SN62, with melting points of 183°C and 179°C respectively. In phased reflow process, small amounts of SN62 wets both sides of termination before SN63's melting point is reached, tack-soldering components to PCB, and delivering larger assembly process windows.



Original Press Release:



Loctite Introduces Phased-Reflow Anti-Tombstoning No Clean Solder Paste



Industry, Calif. - December 7, 2001. Loctite Corporation has introduced new Loctite® Multicore® 63S4 RP15 no clean solder paste, formulated with the unique 63S4 alloy that eliminates costly tombstone defects that occur when reflowing boards with small components.

For smaller components such as 0201 and SOT's that dramatically increase tombstoning defects on PCBs, Loctite Multicore 63S4 RP15 offers a wider process window to compensate for inaccuracies in screen printing, pick-and-place, and thermal profiling. By eliminating tombstoning defects, 63S4 RP15 solder paste increases production yield, reduces the costs of rework, and improves overall quality. The 63S4 alloy minimizes the need
to repair defective boards or discard scrap PCBs.

Loctite 63S4 RP15 is a drop-in replacement for standard lead alloys. The 63S4 alloy blends SN63 and SN62, with melting points of 183°C and 179°C respectively. In a phased reflow process, a small amount of SN62 wets both sides of the termination before the SN63 melting point is reached, tack-soldering components to the PCB and delivering a larger assembly process window.

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