SMT Optocouplers are suited for low-profile applications.

Press Release Summary:

Designed to meet UL international safety standards, TLP109 and TLP116A are supplied in SO6 package with 0.4 mm thick (min) internal insulation that provides isolation voltage of 3,750 Vrms (min) as well as clearance and creepage distances of 5 mm (min). Transistor-transistor logic (TTL)-compatible TLP109 is 30 V (max), 1 Mbps general-purpose photocoupler with open-collector output, while TLP116A is 6 V (max), 20 Mbps device with high-speed totem-pole output.

Original Press Release:

Toshiba Announces Low Profile, Reinforced Insulation Photocouplers

Surface Mount Optocouplers in Thinner SO6 Package Meet UL Safety Standard Requirements

IRVINE, Calif., March 3 -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, announced two photocouplers housed in low profile SO6 packages that are 18 percent (0.5mm) thinner than the mini-flat SOP6 package (MFSOP6), yet maintain high isolation voltage and meet UL international safety standards(1). The two new devices, developed by Toshiba Corp. (Toshiba), are the TLP109, a 30V (max.), 1Mbps general-purpose photocoupler with open-collector output, and the TLP116A, a 6V (max), 20 Mbps device with high-speed totem-pole output.

"The SO6 package used for the new devices is pin compatible with the widely used MFSOP6 package, while enabling use in low-profile applications," said Talayeh Saderi, business development engineer for the optoelectronics group at TAEC. "Packaging features that help meet international safety standard requirements include isolation voltage of 3750 V(rms) (min.), clearance and creepage distances of 5mm (min.), with internal insulation of 0.4 mm minimum thickness."

The 1 Mbps TLP109 is Transistor-transistor logic (TTL) compatible and targeted for applications such as digital logic isolation, line receivers, power supply feedback control, switching power supplies and transistor inverters. It features fast switching with propagation delay of 0.8 microsecond (max.), with a common mode transient immunity ratio (CMR) of +10kV/microsecond (typ.).

The 20 Mbps TLP116A is targeted for applications such as plasma display panels, high-speed interfaces and factory automation. It features inverter logic with propagation delay times of 60 nanoseconds (max.), and CMR of +10kV/microsecond (min.).
  Technical Specifications TLP109

Specification Symbol

Package SO6 4.55mm x 3.7mm x 2.1mm
Output type General purpose, open collector
Power supply
voltage(2) V(CC) -0.5V to 30V
Output voltage(2) V(O) -0.5V to 20V
Current transfer
ratio (min.) I(O)/I(F) 20%
Low level output
voltage (max.) V(OL) 0.4V
Propagation delay
(max.) (H to L) t(pHL) 0.8 microseconds
Propagation delay
(max.) (L to H) T(pLH) 0.8 microseconds
temperature range T(opr) -55 degree C to +100 degree C
transient C(MH),
immunity C(ML) + to - 10kV/microseconds (typ.)
Voltage (min.) BV(S) 3750V(rms)

Technical Specifications TLP116A

Specification Symbol
Package SO6 4.55mm x 3.7mm x 2.1mm
Output type Totem pole
Power supply
voltage(2) V(CC) 6V (max.)
Output voltage(2) V(O) 6V (max.)
Low-level output
voltage (max.) V(OL) 0.4V
High-level output
voltage (min.) V(OH) 4V
Low-level supply
current (max.) I(CCL) 5mA
High-level supply
current (max.) I(CCH) 5mA
Negative-going input
threshold current
(max.) I(FHL) 5mA
Positive-going input
threshold voltage
(min.) V(FHL) 0.8V
Propagation delay
(max.) (H to L) t(pHL) 60 nanoseconds
Propagation delay
(max.) (L to H) t(pLH) 60 nanoseconds
range T(opr) -40 degree C to +100 degree C
transient C(MH),
immunity C(ML) + to - 10V/microseconds (min.)
Isolation voltage (min.) BV(S) 3750V(rms)

Pricing and Availability

Samples of the Toshiba TLP109 and TLP116A low-profile photocouplers are available now. The TLP109 is priced at $0.85 each in quantities of 125, and the TLP116A is priced at $1.50 in quantities of 125.

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2007 Worldwide Semiconductor Market Share Report," Gartner, released April 2008). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, photocouplers, Toslinks(TM), LEDs, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About TAEC and Toshiba Corp.

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, Preliminary 2008 WW Semiconductor Revenue Ranking, Dec. 2008). For additional company and product information, please visit

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at, or from your TAEC representative.

1. UL approved: UL1577, File No. E67349

2. Absolute maximum-rated conditions, T(a) = 25 degree C.

CONTACT: Jan Johnson of MultiPath Communications, +1-714-633-4008,, for Toshiba America Electronic Components, Inc.; or Poloi Lin of Toshiba America Electronic Components, Inc., +1-949-623-3098,; or reader inquiries,

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