Rudolph Technologies Announces Multiple-Tool Order from Premier Memory Solutions Provider in Taiwan
DRAM manufacturer intends to boost yield with automated macro defect inspection
Flanders, New Jersey, March 13, 2006¯Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit manufacturing, announced today the completion of a multiple system sale to a premier memory solutions provider based in Taiwan. The original order, which consisted of multiple WaferView(TM) macrodefect inspection systems and a YieldView(TM) data management system, was fulfilled in the second half of 2005; it has now been followed by a repeat order for a WaferView system, to be delivered this month.
The WaferView solution has helped the DRAM manufacturer to boost yield by quickly identifying the root cause of defects, reducing the number of misprocessed wafers and speeding correction of process excursions. Rudolph's YieldView server manages the enormous amount of data generated by the WaferView tools during the wafer inspection process. The repeat order provides tangible evidence of the success of the program.
"We are delighted that semiconductor manufacturers are realizing the benefits of automated macrodefect inspection," said Nathan Little, Executive Vice President and General Manager of Rudolph's Inspection Business Unit. "Using WaferView, they are able to enhance their productivity by identifying defects early in the process so that the wafers can be reworked, and quickly identify process excursions before additional wafers are misprocessed. We are especially gratified by this follow-on order, which demonstrates this customer's confidence in the WaferView/YieldView solution. Equally important, it confirms for us the value of macrodefect inspection in semiconductor manufacturing and our strategy to expand in that segment through our recent merger with August Technology."
Manufacturers are moving away from the relatively slow, manual inspection of only a small percentage of the wafers being processed. Automated macrodefect inspection allows high-throughput inspection of the front, back and edge of 300 mm wafers.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. Rudolph has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
For more information, please contact:
Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com
