Rudolph Continues Leadership in Automotive IC Inspection with Order from austriamicrosystems
FLANDERS, NJ (February 22, 2007)-Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process control metrology, defect inspection and data analysis for the semiconductor manufacturing industry, today announced the sale of both front- and back-end inspection systems to austriamicrosystems (SWX: AMS), a leading global designer and manufacturer of high performance analog integrated circuits (ICs) for communication, industrial, medical and automotive applications.
austriamicrosystems has purchased one AXi(TM) Series tool, a cleanroom compatible, high-resolution macro defect inspection system for front-end processes, and one NSX® Series tool, which is designed to handle macro defect inspection of wafers and thin wafers on film frames in back-end processes. A major supplier to the European automotive industry, austriamicrosystems will use the new Rudolph inspection tools for internal process control and yield enhancement, as well as to meet the zero defect requirements of its automotive customers for outgoing inspection.
The order was placed after a direct competitive evaluation and consolidates Rudolph's dominant position within the automotive semiconductor inspection market. Primary criteria in the evaluation were demonstrated process capability, including the ability to share data between front- and back-end applications, and a proven record of local service and support.
"Rudolph could demonstrate and prove the capability to address the full range of inspection requirements throughout our manufacturing process," said Johan Oosterlee, vice president-purchasing at austriamicrosystems. "The AXi System has the resolution and Class 1 cleanroom compatibility we need for our front-end processes. These are key contributing factors in reducing our production costs through yield improvement. Likewise, the NSX System has the flexibility we need in the final manufacturing process where we may need to inspect full wafers, film frames, ultra-thin wafers and other specialized applications. The ability to share data between systems can enhance our ability to look for relationships between front-end and back-end defectivity mechanisms."
"austriamicrosystems conducted a very thorough evaluation of the inspection solutions available on the market, and we are very pleased to receive this order from them," said Nathan Little, executive vice president and general manager of Rudolph's Inspection Business Unit. "The automotive industry is one of the leading industrial sectors requiring outgoing quality control with 100 percent inspection requirements. We currently supply inspection capability to every major automotive chip provider, and we are gratified to see our technology emerging as the de facto industry standard."
Rudolph's AXi Automated Macro Inspection System is designed to detect wafer level and die level defects as small as 0.5 microns. Chipmakers in search of high resolution and speed are choosing advanced macro defect inspection tools to drive yield and productivity in multiple wafer processing applications. The NSX System is an established, high-throughput, highly repeatable macro defect inspection solution for back-end inspection applications, including wafer probe, wafer bump and wafer saw. Defect information may be transferred to yield management programs, including Rudolph's DMS Decision(TM) software and fabwide DMSVision(TM) software for further analysis and review, to help reduce manufacturing costs and time to market.
Background
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
About austriamicrosystems
austriamicrosystems is a leading designer and manufacturer of high performance analog ICs, combining more than 25 years of analog design capabilities and system know-how with its own state-of-the-art manufacturing and test facilities. austriamicrosystems leverages its expertise in low power and high accuracy to provide industry-leading customized and standard analog products. Operating worldwide with more than 1,000 employees, austriamicrosystems focuses on the areas of power management, sensors & sensor interfaces, portable audio and car access in its markets Communications, Industry & Medical and Automotive, complemented by its Full Service Foundry activities. austriamicrosystems is listed on the SWX Swiss Exchange in Zurich (ticker symbol: AMS). For more information, please visit the website at www.austriamicrosystems.com
For more information, please contact:
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com
