QFN Socket accommodates 0.5 mm pitch devices.

Press Release Summary:

Designed for 10 mm package size, Model SG-MLF-7025 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Socket dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with low-inductance elastomer, device features temperature range of -35 to +100°C, contact resistance of 23 mW per pin, pin inductance of 10.15 nH, and capacitance to ground of 0.10 pF.

Original Press Release:

High Performance Socket for 0.5mm PitchSTATSChipPAC 10x10x0.85 QFN IC

Ironwood Electronics has recently introduced the new high performance QFN socket for 0.5mm pitch devices. The SG-MLF-7025 sockets are designed for a 10mm package size, operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The socket connects all pins and the optional center power pad with 10+ GHz bandwidth on all connections.

The SG-MLF-7025 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +100 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates IC packages such as the STATSChipPAC 10x10x0.85, 0.5mm QFN with 72 pads. Simply attach the socket to the PCB, drop in chip, place lid. In addition the open lid allows probing of die or direct injection of heat or cooling air.

Pricing for the SG-MLF-7025 $508 at qty 1 with reduced pricing available depending on quantity required.

Further information and picture can be found at: http://www.ironwoodelectronics.com/press/stats_chip_pac.html

Please feel free to call or email if you have questions.
Mike Fedde
Ironwood Electronics

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