No-Clean Solder Paste offers hot slump resistance.

Press Release Summary:



Suited for broad range of lead-free surface mount applications, 862 Solder Paste has broad processing window designed to minimize transition concerns from Sn/Pb process. Product yields no or low solder beading and bridging and optimal print performance across various board designs. Compliant with ROL0 IPC and IPC Class III voiding classifications, paste is compatible with most lead-free alloys, and is available in standard form as well as in green color with SAC alloys.



Original Press Release:



New! Product 862 No Clean Lead Free Solder Paste



862 is a new solder paste designed for a broad range of lead free surface mount applications. Qualitek's 862 broad processing window is designed to minimize transition concerns from Sn/Pb process. 862 yields excellent print capability performance across various board designs. Excellent hot slump resistance: Yields No or Low Solder Beading & Bridging. Qualitek has developed a unique flux system designed specifically for high temperature lead free alloy that produces shiny solder joints surrounded by non-conductive, smooth, clear and highly insulated post soldering residue.

862 complies with ROL0 IPC and IPC Class III voiding classifications ensures long-term product reliability. 862 No Clean Solder Paste is available in standard form as well as in GREEN color with SAC alloys and is compatible with most other lead free alloys.

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