OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies.
The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in Nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of conventional nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures without the need for external pressure.
ALUSAC-35 is a new lead-free alloy for soldering aluminum. The high reliability alloy is corrosion resistant and provides excellent soldering joint.
The High-Activated Liquid Flux: No. 1261 has been designed for soldering to aluminum wire and aluminum wire harness, and dipping for aluminum wire.
SN100C P820 D5 no flux residue solder paste has been released for semiconductor components. Features include: less flux residue, excellent wettability and excellent printability. After reflow it is not necessary to clean flux with water, saving production costs and time in the production line.
Nihon Superior offers a range of products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection and process yields. For more information about Nihon Superior’s new solder pastes and lead-free products, meet company representatives at the show or visit the company on the Web at www.nihonsuperior.co.jp/english.
About Nihon Superior Co., Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
Nihon Superior Co., Ltd.
Overseas Sales Section
NS Bldg., 1-16-15 Esaka-Cho,
Suita City, Osaka,
Web site: www.nihonsuperior.co.jp/english