Press Release Summary:
- Module size is 10.0mm(L) x 7.2mm(W) x 1.4mm(H)
- Based on the Cypress CYW43012 combo chipset, the ultra-small dual-band Wi-Fi 11a/b/g/n/ +Bluetooth 5.0 module provides data transference rates up to 78Mbps on Wi-Fi and 3Mbps on bluetooth
- Supports a broad range of popular processors including PSoC6, i.MX RT, STM32, i.MX and IP camera platforms as well as Linux & RTOS based applications
Original Press Release:
Lowest Power, Small Form Factor Wi-Fi® and Bluetooth® Combo Module Significantly Improves Battery Life
Smyrna, Ga., March 21, 2019 /PRNewswire/ -- Murata Manufacturing Co., Ltd. announced that it collaborated with Cypress Semiconductor Corp. to develop the Type 1LV (CYW43012) solution that is the lowest power, small form factor Wi-Fi® and Bluetooth®module. This product improves battery life in wearables, smart home products, and portable audio applications. When comparing Type 1LV (CYW43012) to the Type 1DX (CYW4343W), power usage in the previous is approximately 54 percent lower in DTIM 1, 60 percent in DTIM 3, up to 50 percent for 2.4 GHz RX, and 28 percent for 2.4 GHz TX.
Based on the Cypress CYW43012 combo chipset, the ultra-small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly™) +Bluetooth 5.0 module provides data transference rates up to 78Mbps on Wi-Fi and 3Mbps on Bluetooth. The Type 1LV supports a broad range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP Camera platforms, as well as Linux and RTOS based applications.
The Type 1LV uses highly sophisticated and enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth coexistence is optimized for maximum performance. An embedded Ipv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections. The module also supports BLE 2Mbps, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks. The module size is 10.0mm(L) x 7.2mm(W) x 1.4mm(H). It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.
"Teaming with Cypress allows us to leverage our combined expertise in delivering breakthrough solutions that are game-changers for the market," said Mehul Udani, Director, Connectivity Solutions for Murata Americas. "Using our proprietary packaging and miniaturization technologies, Murata leads in developing turnkey, transformational tools that ease integration and enable connectivity to help bring IoT to fruition. With this lowest Wi-Fi power module, we now enable a new class of products that were previously designated for Bluetooth."
"The Cypress CYW43012 combo solution continues its forward momentum in the market as OEMs demand key benefits including best-in-class throughput and power efficiency," said Brian Bedrosian, Vice President of Marketing for the IoT Compute and Wireless Business Unit at Cypress. "Our collaboration with Murata in integrating the CYW43012 delivers a compact, pre-tested solution that has helped position Cypress as the supplier of choice for OEMS delivering high performance, long battery-life IoT solutions in applications including cameras, music, healthcare, and security."
The Type 1LV module is now in mass production. For more information, visit: https://wireless.murata.com/type-1lv.html.
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components and solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world. For more information, visit Murata's website at www.murata.com.