New TPSM53604 DC/DC Buck Module Meets EMI Standards
Comes with single thermal pad to optimize heat transfer that enables engineers to simplify board mounting and layout. Operates in ambient temperatures as high as 105°C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defense. Offered in quad flat no-lead (QFN) package with 5 mm. by 5.5 mm....
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New COM Express Type 6 Module Can Withstand in Harsh Operating Conditions
Features Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors with the Intel® CM246/QM370/HM370 chipset. Equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory and has operating temperature range of -40°C to +85°C. Comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM...
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New NVMe SSDs Modules are Available in I-Temp (N600Si) and C-Temp (N600Sc) Ratings
Features 8 Gb/s PCIe Gen3 x4 lanes of simultaneous data flow with eight NAND channels. Offers end-to-end data protection, breakthrough power management and power loss protection (PLP). Leverages proprietary 2 KB codeword Low-Density Parity-Check (LDPC) ECC with embedded programmable RAID engine that enhances the endurance and data retention of 3D TLC NAND.
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New STRIDE Field I/O Modules Available with up to 8 Current or Voltage Inputs
Provides simple and economical means to connect inputs and outputs to a Modbus TCP communications network via Ethernet 10/100 Base-T. Operates as a standalone Modbus TCP server and can be remotely configured via a built-in web server. Offers up to 16 discrete inputs each with options for discrete and relay outputs.
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Sales and Marketing in the Manufacturing Industry and How CRM Can Help
To learn more about the importance of CRM and how it can specifically address your company's needs, download now.
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New Clamping Module for Compact Applications in Metal Cutting Industry
VERO-S NSE mikro 49-13 is actuated via an axial piston and achieves high pull-down forces despite the compact dimensions. Combines compact dimensions, high pull-down and holding forces, a high dimensional stability and a high repeat accuracy of < 0.005 mm. Locking is done mechanically via a spring assembly, it is self-retaining and locks form-fit.
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New Type 1SJ LoRa Module Incorporates Low Power Modes
Features an open STM32L0 microcontroller from STMicroelectronics along with an RF switch and 192kB of flash memory and 20kB of RAM. Allows real time clock to operate while drawing a typical current of just 1.3 µA. Suitable for wide range of high-volume applications where small size, long range, extended battery life, security and a competitive price point are requirements.
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New ARC HS4x/4xD Development Kit Includes 4 GB of DDR Memory
Features an on-board WiFi (802.11abgn) and Bluetooth (BT4.0) module. Include peripherals and interfaces such as Ethernet, GPU, HDMI, USB, SD card, Bluetooth, WiFi, audio I/O and A-to-D converters. Operates at 1GHz includes 4GB of DDR memory and allow developers to extend the kit to add new functionality.
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New Power Entry Modules Integrate IEC Inlet and EMC Filter
DG12 and DG11 feature recessed 2-pole on/off rocker switch circuit breaker with 1 or 2-pole overcurrent protection. DG12 includes standard and low leakage mains filter as well as standard and high inductive performance options. Modules are IEC rated up to 10 A at 250 VAC and UL/CSA rated up to 15 A at 125/250 VAC.
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New AP730 Multi-function I/O Module Can Move Data Between Module Memory and PCIe Bus
Features high-density mix of 28 I/O channels and 32-bit counter/timers in 30 x 70 mm. card. Offers eight differential analog inputs (0-10V, ±10V ranges) feed 16-bit A/D converter capable of sampling at nearly 800 KHz. Bidirectional digital I/O is configured as two 8-channel groups with TTL-compatible thresholds and programmable change-of-state or level interrupts.
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New FMC259 Fiber FMC+ Module Meets VITA 57.4 (FMC+) Specification
Offers dual board-mount optical assemblies, each providing 24 channel full-duplex transceivers capable of up to 28.1 Gb/s per channel. Provides clock data recovery and front-panel fiber I/O via MTP/MPO that has on board ultra-low jitter clock generator with two independent, fractional PLL. Features clocking that allow synchronization to an external clock input or on board and comes with LEDs in...
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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