Mounting Adhesive Film exhibits thermal, mechanical stability.
Press Release Summary:
Used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations, Wafer-Mount(TM) 559 is available in 10 x 10 x 0.005 in. sheet and can be cut to desired shape. Semi-rigid, solvent-resistant, plastic film has PSA layer that accommodates machining operations that produce heat, vibration, and peel stresses. After use, substrate is removed from adhesive film by heating to 300°F for 2-3 min.
Original Press Release:
Wafer-Mount(TM) 559 Mounting Adhesive Now Available
SUMMARY
Wafer-Mount(TM) 559, a new high strength, film adhesive produced by Aremco Products, Inc., is now used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations.
FEATURES
Aremco's Wafer-Mounttm 559 is an advanced, semi-rigid, solvent-resistant, plastic film with pressure sensitive adhesive layer that provides exceptional mechanical and thermal stability, important requirements for machining operations that produce severe heat, vibration and peel stresses.
Wafer-Mount(TM) 559 is easy use by cutting to the desired shape, then peeling away the backing paper and affixing the adhesive film to a substrate. The film/substrate part is then mounted to a vacuum chuck for dicing or scribing operations. After use, the substrate is removed from the adhesive film by heating to 300 oF for 2-3 minutes to peel away the film. Residual adhesive is dissolved easily in a ketone-based solvent.
Wafer-Mount(TM) 559 is available in a convenient-to-use sheet that is 0.005" thick x 10" x 10". Please contact Aremco's Technical Sales Department for more information about this advanced new adhesive.
Aremco Products, Inc.
707-B Executive Blvd.
Valley Cottage, NY 10989
For more information or technical assistance, visit our website, www.aremco.com or phone us at 845-268-0039.
