Press Release Summary:
Mill-Max’s Strip Sockets are available in single row (315-43-1XX-41-004000) and double row (415-43-2XX-41-004000) versions with 2.54 mm pin spacing and 2.11 mm profile. The units are used for through hole mounting in boards up to 1.57 mm thick and suitable for board stacking and wire to board applications. Sockets feature 4 finger, beryllium copper contact and accepts leads ranging from 0.38-0.56 mm. Units come with tin or gold outer shell and gold for internal contact plating options.
Original Press Release:
Mill-Max Introduces Super Low-Profile Sockets: Reliable and Compact Sockets for Minimizing Interconnect Height
Oyster Bay, NY, March 27th, 2018 - Mill-Max Mfg., Corp., North America’s largest manufacturer of Precision Machined interconnects is proud to present its lowest profile strip sockets to date. With an above-board height of just .083” (2,11 mm) these sockets provide a reliable and convenient way to connect boards or devices.
Many of today’s products, such as implantable and wearable devices for the medical industry, demand miniaturization along with high functionality and reliability. Those requirements drive designers to find durable solutions to package more electronics into smaller spaces; these new sockets can be exactly what they are looking for.
The new 315-43-1XX-41-004000 (single row) and 415-43-2XX-41-004000 (double row) sockets have .100” (2,54 mm) pin spacing with a low profile of .083” (2,11 mm). They are designed for through hole mounting in boards up to .062” (1,57 mm) thick, providing a secure connection to the PCB. These sockets are ideal for board stacking and wire to board applications where minimizing package height is paramount. When mated with Mill-Max low profile headers, 335- 10-1XX-00-160000 (single row) and 435-10-2XX-00-160000 (double row), the total between the boards height is only .155” (3,94 mm). For wire to board connections the Mill-Max 380-10-1XX00-002000 (Single row) and 480-10-2XX-00-002000 (Double row) solder cup headers combine with the super low-profile sockets to achieve a total height of .268” (6,81 mm).
Each receptacle is precision turned from brass alloy, has a highly reliable 4 finger, beryllium copper contact, accepts leads ranging from .015” - .022” (,38 - ,56 mm) and is designed to withstand the rigors of rugged applications associated with portability. The insulator material is high temperature PCT, compatible with most soldering processes. Connectors are available from 1-32 positions, single row and 4 -72 positions double row. Standard plating options include tin or gold for the outer shell and gold for the internal contact providing optimal interconnect reliability.
For more information, please visit www.mill-max.com/PR685.
Mill-Max is the leading US manufacturer of machined interconnect components with a vertically integrated manufacturing facility headquartered at 190 Pine Hollow Rd., Oyster Bay, NY 11771. Its full product line includes spring-loaded connectors, SIP, DIP, PGA and BGA sockets, board-to-board interconnects and pin headers, surface mount and custom products, PCB pins and receptacles, solder terminals, wrapost receptacles and terminals. The company’s complete manufacturing facility includes engineering, tooling, primary and secondary machining,stamping, plating, injection molding, and assembly.
MILL-MAX MFG. CORP.
190 PINE HOLLOW ROAD
PO BOX 300
OYSTER BAY, NY 11771-0300
PHONE: (516) 922-6000 FAX: (516) 922-9253