Micromachining System optimizes drilling of silicon vias.
Press Release Summary:
Employing 355 nm laser, Model Si5330 is capable of rapidly drilling and routing in most metals, organics, semiconductors, and hybrid-engineered materials. Via drill rates up to 2,000 vps are achievable, depending upon material, thickness, and via's size. System also utilizes digital beam positioner with esiCAM software, and has optical bench flexible enough to enable wide range of process configurations.
Original Press Release:
ESI Launches Its Latest Generation 5330 Micromachining Solution Optimized for Silicon via Drilling
PORTLAND, Ore.-- Electro Scientific Industries, Inc. (Nasdaq: ESIO), a leading provider of world-class photonic and laser systems for micro-engineering applications, today announced the availability of the latest version of the 5330 micromachining system, the Si5330. ESI upgraded the technology in the successful predecessor of the new system, the Flex5330, to optimize drilling of silicon vias. As a result, ESI has already secured the first order for this system, which is estimated to ship during the Company's third fiscal 2009 quarter.
"This is UV technology at its finest. The Si5330 via drilling solution provides unprecedented reliability and high-precision manufacturing required for machining hundreds of thousands of microscopic vias on a single silicon wafer," explained ESI director of interconnect and micromachining solutions Jeff Albelo. "The Si5330's unmatched speed and accuracy enable global chip manufacturers to enjoy exceptional cost-of-ownership and yield advantages."
The Si5330
ESI's Si5330 employs a high-powered 355nm laser capable of rapidly drilling and routing in most metals, organics, dielectrics, semiconductors and hybrid-engineered materials. Via drill rates of up to 2000vps are achievable, depending upon the material, its thickness and the via's size. The system also utilizes a newly updated digital beam positioner with patented esiCAM software, and has an optical bench flexible enough to enable a wide range of process configurations.
About ESI, Inc.
ESI is a pioneer and leading supplier of world-class photonic and laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors--semiconductors, components and electronic interconnect--by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com.
