Micro-Imaging System uses laser confocal technology.
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Press Release Summary:
Suited for applications requiring precise measurements and observation, OLS3000 LEXT System fills gap between optical microscopes and scanning electron microscopes. It offers sub-micron imaging with 0.12 µm and 0.01 µm Z resolution and 3D measurement capability. Requiring no sample preparation or vacuum pumpdown, system provides magnification from 120-14,400x. Confocal laser DIC mode is useful for highlighting subtle textural variations during surface analysis.
Original Press Release:
Olympus Micro-Imaging Announces New Confocal Technology to Fill Gap Between Conventional and Scanning Electron Microscopes
Orangeburg, NY A new laser confocal technology is being announced by Olympus Micro-Imaging that fills the gap between conventional high resolution optical microscopes and scanning electron microscopes (SEMs).
Called LEXT, this new laser scanning confocal technology is designed for applications requiring ultra-precise measurement and observation, such as MEMs fabrication, advanced materials processing, nanoscale production, and semiconductor wafer manufacturing. The new technology, introduced in the OLS3000 LEXT micro-imaging system, features sub-micron imaging with outstanding 0.12 µm and 0.01 µm Z resolution and accurate three-dimensional measurement capability.
To speed up measurement and observation tasks in high volume manufacturing applications, the OLS3000 requires no sample preparation or vacuum pumpdown - samples can be placed directly on the microscope stage for both 3D observation and measurement in real time. Magnification power from 120x to 14,400x is ideal for researchers working between the limits of conventional optical microscopes and SEMs. The new LEXT microscopes enable every user to make quicker, more accurate sample analyses, all based on strict traceability systems.
Because the LEXT microscope uses a laser for pinpoint surface profile measurements, resolution much higher than conventional optical microscopes can be obtained with just as many different observation methods. Brightfield, Darkfield and Differential Interference Contrast (DIC) Microscopy techniques is possible in both white light and laser confocal imaging modes. The new confocal laser DIC mode is especially useful for highlighting subtle textural variations during surface analysis.
Olympus Micro-Imaging is also introducing the LEXT-IR, a near-infrared system operating at a wavelength of 1310 nm for nondestructive, high-resolution observation and measurement through silicon materials.
For more information on Olympus Micro-Imaging's new LEXT confocal microscopy technology, visit www.olympusmicroimaging.com.
