Apr 13 2007
The MC-384 pick & place system, offering the versatility and increased capacity to meet the challenges of today's surface mount prototyping and other short-to-medium run applications, will be showcased at the Autotronic Exhibit, 2L02 at Nepcon Shanghai, April 24-27.
The system, distributed in North American by Manncorp of Willow Grove, PA and San Diego, CA, features Cognex® vision with head-mounted camera to permit non-contact "on-the-fly" alignment of SMDs, from 0201s through CSPs, µBGAs, flip-chips and others up to 38 x 38mm. Smart feeder bases can be mounted on all 4 sides of MC-383, each loaded with up to 32 smart 8mm tape feeders, while the balance of the payload area of up to 14.5" x 13.4" (370mm x 340mm) can be shared by PCBs and waffle trays. With feeder bases mounted on just the front and read of the system, placement area can be increased to 17.1 x 13.4" (435 x 340mm). For more information, access manncorp.com or call 800.PIK.MANN (745.6266).