Press Release Summary:
Able to produceÂ complete wafer characterization within packaging process, NSXÂ® 330 Series provides high-speed macro defect inspection and 2D and 3D metrology. Optional metrology capabilities for both 2D and 3D applications include 100% bump height and coplanarity, and 3D capability enables simultaneously measurement of topography and thickness with nanometer-level repeatability. Compatibility and functionality help accelerate ramp and improve yield.
Original Press Release:
Rudolph Technologies NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology
Newest macro defect inspection tool with configurable 2D and 3D measurements provides superior capability and cost of ownership
Flanders, New Jersey—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the widespread adoption and success of its newest macro defect inspection tool, the NSX® 330 Series. The NSX 330 Series provides high-speed macro defect inspection and 2D and 3D metrology for advanced packaging applications, which are being developed to support the mobility and the growing Internet of Things (IoT) markets. It has been quickly and enthusiastically adopted, garnering repeat orders from top foundries, integrated device manufacturers (IDMs) and outsourced assembly and test (OSAT) manufacturers. The NSX 330 Series will be on display at SEMICON® Taiwan, September 2-4, 2015.
“A large number of advanced packaging processes are being developed by OSATs, foundries and IDMs, each of which has slightly different inspection and metrology requirements,” said Rudolph’s Mike Goodrich, vice president and general manager of the Inspection Business Unit. “Customers have embraced the NSX 330 Series’ capability to solve the unique metrology process control challenges in advanced packaging applications, while also providing a 30 percent 2D inspection throughput improvement over the previous generation NSX 320 System. The NSX 330 Series offers an array of optional metrology capabilities for both 2D and 3D metrology applications, including 100 percent bump height and coplanarity. Customers have come to rely on the system’s superior 3D capability, specifically the ability to simultaneously measure topography and thickness with nanometer-level repeatability.
“The versatility of the NSX 330 Series has been an important feature that has enticed manufacturers to implement the system in their final assembly and test processes,” added Goodrich. “For example, for applications such as flip chip, copper pillar bump, fan-out wafer level packaging (FOWLP) and through silicon vias (TSVs), manufacturers can achieve lower costs by consolidating inspection and a variety of metrologies onto a single tool platform, reducing the number of tools required and simplifying their process of record.”
The NSX Series is a key component of Rudolph’s broad product family that includes lithography, metrology, inspection and software to address high-value problems with process and yield enhancing solutions. “Our customers and their customers are demanding increased data richness,” stated Mike Plisinski, Rudolph’s executive vice president and chief operating officer. “The NSX 330 Series produces a complete wafer characterization within the packaging process. Coupled with advanced analytics from Discover® Enterprise yield management software and Equipment Sentinel™ fault detection and classification software, the NSX Series provides manufacturers with the ability to accelerate ramp and improve yields. We are very pleased with the customer response to our increased value proposition and we will continue to provide and support leading-edge process and control solutions.”
For more information about the NSX 330 Series system, please visit www.rudolphtech.com. Or visit Rudolph at SEMICON Taiwan, booth #400, taking place September 2-4, 2015.
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and data analysis systems and software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. The Company’s expanding portfolio of equipment and software provides comprehensive solutions for front-end wafer processing, final manufacturing and advanced packaging of ICs. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.
Steven R. Roth