Low Voltage MOSFET suits power management applications.
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Press Release Summary:
Model FDJ129P P-channel MOSFET features PowerTrench® technology in compact SC75 Flip Leaded Molded Package. Power dissipation is 1.8 W and max steady-state current rating is 4.2 A. Unit reduces system power drain by providing low-loss switching, with max pulsed current of 16 A. FLMP packaging eliminates wire-bonds to provide extremely low electrical resistance. It also provides low thermal resistance path between PCB and MOSFET die.
Original Press Release:
Fairchild Semiconductor's Low-Voltage MOSFET in SC75 FLMP: Packaging Uses 60% Less Board Space, Increases Current Handling Capability While Reducing Switching Loss and Power Consumption
San Jose, Calif.-July 24, 2003- Fairchild Semiconductor (NYSE: FCS) today announced the FDJ129P, a new P-Channel MOSFET that offers a combination of performance and space-savings benefits in power management applications such as cell phones, PDAs, portable music players, GPS receivers, low voltage/low power DC-DC converters, and digital cameras. The FDJ129P features Fairchild's high-performance PowerTrench® technology in a compact SC75 FLMP (Flip Leaded Molded Package). The result of this advanced technology combination is a 60% board space reduction, compared to similar MOSFET solutions offered in SSOT-6 or TSOP-6 packages. The FDJ129P's power dissipation is 1.8W and has a maximum steady-state current of 4.2A--a maximum steady-state current rating twelve times greater than competitive SC75-packaged technology.
The FDJ129P offers similar performance to a typical TSOP-6 based product, such as the FDC640P, but consumes 60% less board area and has a 34% lower profile than the TSOP-6 package. Chris Winkler, market development manager for portable product applications said, "Customers now have choice of reducing their circuit board size or upgrading their circuit to higher current operation utilizing the capability of the SC75 FLMP."
In addition, the FDJ129P reduces system power drain by providing low-loss switching, with a maximum steady-state current of 4.2A and a maximum pulsed current of 16A.
Fairchild is the first to offer a P-Channel MOSFET in FLMP packaging. This patented package eliminates conventional wire-bonds to provide extremely low electrical resistance. The FLMP package also provides a low thermal resistance path between the PCB and the MOSFET die (drain connection). The combination of lower electrical resistance and lower thermal resistance greatly enhances performance in power management applications.
The reduced package height of the FDJ129P (maximum 0.8mm) allows this product to be used under RF shields and internal sub-assemblies and displays, fulfilling the industry growing demand for products for thinner, low-profile packages. In addition to packaging advantages, this new device provides extremely low RDS(on) (70mΩ @ VGS = -4.5V and 120mΩ @ VGS = -2.5V) and low gate charge (@VGS +/- 12V =Qg ≤6nC).
The addition of this SC75 FLMP-packaged P-Channel MOSFET expands Fairchild's portfolio of products targeted at portable applications. These products include audio amplifiers, LEDs for backlighting, supervisory products, such as temperature sensors and reset generator circuits, as well as LDOs and TinyLogic®.
Package Comparison of Electrical and Thermal Performance:
Parameter FDJ129P FDC640P
Package SC75 FLMP SSOT-6
BVdss -20V -20V
Vgs max 12V 12V
Id max (steady-state) 4.2A 4.5A
Id max (pulsed) 16A 20A
RDS(on) @ 4.5V Vgs 70mOhm 53mOhm
RDS(on) @ 2.5V Vgs 120mOhm 80mOhm
Rtheta-JA deg-C/W 77 78
Package Profile 0.8mm 1.22mm
Package Foot Print 3.7mm² 9.0mm²
Price: US $.33 (1000 pcs.).
Availability: Now
Delivery: 8 weeks ARO
For more information about this product go to www.fairchildsemi.com/pf/FD/FDJ129P.html. For information on other Fairchild products, design tools, and sales contacts, please visit www.fairchildsemi.com.
Editor's Note: A PDF of the datasheet is available at http://fairchildsemi.com/ds/FD/FDJ129P.pdf.
Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) is a leading global supplier of high performance products for multiple end markets. With a focus on developing leading edge power and interface solutions to enable the electronics of today and tomorrow, Fairchild's components are used in computing, communications, consumer, industrial and automotive applications. Fairchild's 10,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products from its headquarters in South Portland, Maine, USA and numerous locations around the world. Please contact us on the web at www.fairchildsemi.com.
