Low-Power Logic ICs feature dual buffer logic gates.

Press Release Summary:

Supplied in 6-pin 1.6 x 1.6 x 0.55 mm ES6 or 2.1 x 2.0 x 0.9 mm US6 packages, LVP series L-MOS Logic ICs support input voltages up to 5 V and are offered with 5 dual logic gates. ROHS-compliant products optimize circuit design in portable electronics and function as dual inverter, dual non-inverter, dual Schmitt inverter, dual Schmitt buffer, or dual inverter (UN-buffer), depending on model. US6 package offers output power down protection to 3.6 V.

Original Press Release:

Toshiba Expands Low Voltage Operation, Low Power Consumption LVP Series L-MOS Logic Series with Dual Buffer Logic Gates in Two 6-Pin Packages

Thin, Compact Packages for LVP L-MOS Series Offer Designers of Mobile Products Added Versatility With Smaller Mounting Area, Two Logic Gates, and 65 Percent Lower Power Consumption at 10MHz Operation

IRVINE, Calif., March 26 -- Toshiba America Electronic Components, Inc. (TAEC)* has expanded its family of low voltage operation, low power consumption LVP series L-MOS (one gate Logic ICs) with five dual logic gates in two thin, compact 6-pin packages. Developed by Toshiba Corp., the new LVP L-MOS devices feature high speed, low voltage drive and up to 65 percent lower power consumption(1) than the standard Toshiba VHS series. L-MOS are versatile components used to optimize circuit design in a wide range of portable electronics such as cell phones, PDAs, audio players and notebook PCs.

The 6-pin LVP series supports a range of input voltage up to 5V so that the logic ICs can comply with a variety of systems, including those with more than one operating voltage. Designers can choose from two compact packages depending on board space requirements. The two package options include the ES6, measuring 1.6mm x 1.6mm x 0.55mm, and US6, measuring 2.1mm x 2.0mm x 0.9mm. The LVP L-MOS family supports Lead(Pb)-Free(2), and ROHS-Compatible(3) requirements.

"The new LVP logic series continues the L-MOS logic innovations initially pioneered by Toshiba more than a decade ago," said Homayoun Ghani, business development manager, microwave, RF and small signal products for TAEC. "Its low operating voltage, high speed driving, reduced power consumption and smaller packages provide additional options for circuit design and optimization of cellular phones, hand-held systems and portable media players."
Technical Specifications
6-Pin LVP Series L-MOS Logic ICs

Package: 6-pin ES6 (SOT-563) 1.6mm x 1.6mm x 0.55mm

Part Number Functions Input Output Sample
Tolerant Power Down Availability

TC7PG04AFE Dual Inverter 5.5 V -- Now

TC7PG34AFE Dual NON- 5.5 V -- Now
Inverter Available

TC7PG14AFE Dual Schmitt 5.5 V -- Now
Inverter Available

TC7PG17AFE Dual Schmitt 5.5 V -- Now
Buffer Available

TC7PGU04AFE Dual Inverter 3.6 V -- April
(UN-Buffer) Available 2007

Technical Specifications
6-Pin LVP Series L-MOS Logic ICs

Package: US6 (SOT-363, SC-88) 2.1mm x 2.0mm x 0.9mm

Part Number Functions Input Output Sample
Tolerant Power Down Availability

TC7PG04FU Dual Inverter 5.5 V 3.6V Now
Available Available

TC7PG34FU Dual NON- 5.5 V 3.6V Now
Inverter Available Available

TC7PG14FU Dual Schmitt 5.5 V 3.6V Now
Inverter Available Available

TC7PG17FU Dual Schmitt 5.5 V 3.6V Now
Buffer Available Available

TC7PGU04FU Dual Inverter 3.6 V -- May
(UN-Buffer) Available 2007

Pricing and Availability

Samples of selected 6-pin LVP L-MOS dual gate logic ICs are available now, and the remainder will be available by second quarter, 2007. (See table above for details.) These devices range in price from $0.11 to $0.12 each in sample quantities.

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier and moved into fourth place in overall semiconductor sales. (Source: "2005 Worldwide Semiconductor Market Share Report," Gartner, released April 2006). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, L-MOS logic, CMOS logic, optoelectronics, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About TAEC

Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.

TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's largest semiconductor manufacturer and the world's fourth largest semiconductor manufacturer. In more than 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com. Photo available for download at http://toshiba.com/taec/news/press_releases/2006/disc_07_469.jsp

(1) At 10MHz . For purposes of measuring frequency in this context, one Megahertz = 1,000,000 cycles per second.

(2) Toshiba defines "Lead(Pb)-Free" in accordance with current industry standards as no more than 0.1 percent lead(Pb) by weight in Homogenous Materials(4). This does not mean that Toshiba products that are labeled "Lead(Pb)-Free" are entirely free of lead(Pb).

(3) Toshiba Semiconductor Company defines "RoHS-Compatible" semiconductor products as products that either (i) contain no more than a maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and no more than 0.01% by weight in homogenous materials for cadmium; or (ii) fall within one of the stated exemptions set forth in the Annex to the RoHS Directive(5).

(4) Homogeneous Materials -- Toshiba Corporation Semiconductor Company Ltd. defines "Homogeneous Materials" to mean a material that cannot be mechanically disjointed into different materials. The term "homogeneous" is understood as "of uniform composition throughout," so examples of "Homogeneous Materials" would be individual types of plastics, ceramics, glass, metals, alloys, paper, board, resins and coatings. Toshiba Corporation Semiconductor Company defines the term "mechanically disjointed" to mean that the materials can, in principle, be separated by mechanical actions such as unscrewing, cutting, crushing, grinding or abrasive processes.

(5) Toshiba Semiconductor Company defines the "RoHS Directive" as the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

Information in this press release, including product pricing and specifications, content of services and contact information, is current on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com/, or from your TAEC representative.

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