Inspection System offers all-surface macro defect detection.
Press Release Summary:
Combining wafer frontside inspection capability of AXi(TM) 935 Macro Defect Inspection tool with edge inspection capability of E25(TM) Wafer Edge Inspection module, Wafer Inspection System accommodates automatic inspection of both front surface and edge of wafer without significantly impacting inspection throughput. Inspection data can be fed forward for automatic disposition of both wafers and die for quality assurance.
Original Press Release:
Rudolph Technologies Begins Shipping Next-Generation Wafer Inspection System
Leading U.S. Flash Memory Manufacturer Embraces All-Surface Inspection Methodology for QA Process
Flanders, NJ (June 26, 2006)- Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process control equipment for thin film measurement and macro defect inspection, including data analysis software solutions, today announced the first shipment of an advanced all-surface macro defect detection system to a leading U.S.-based flash memory manufacturer. The system, which will be installed in a quality assurance environment, combines the wafer frontside inspection capability of the fast, new AXi(TM) 935 Macro Defect Inspection tool with the edge inspection capability of the recently-introduced E25(TM) Wafer Edge Inspection module.
"The AXi 935 is the next generation in the AXi line, complementing the widely adopted AXi 930, and offers significantly higher throughput while still maintaining the high resolution advanced macro inspection capability customers have come to rely on," said Ardy Johnson, vice president of marketing for Rudolph. "The combination of the AXi 935 and E25 on a single platform accommodates automatic inspection of both the front surface and edge of the wafer in a single system without significantly impacting inspection throughput. The inspection data can be fed forward for automatic disposition of both wafers and die for quality assurance."
The E25 Wafer Edge Inspection module includes several new and enhanced features including brighter illumination, increased surface coverage, simplified recipe creation and improved detection algorithm for edge chips and cracks.
All-surface macro defect inspection, used in wafer manufacturing and final manufacturing processes, has seen rapid acceptance since its recent introduction. Modules are also available for wafer backside inspection.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
