High Speed Elevated Array offers design density and flexibility.

Supporting 28+ Gbps applications and PCIe®/XAUI specifications, SkyRay™ consists of one riser and 2 receptacles (TPAR/TPAF Series) that, when mated, provide elevated 35 mm stack height. High-density wafers inside riser have helical crossover design to reduce crosstalk in 100 Ω differential applications, and choice of 1, 2 or 3 module configurations is available with 50 differential pairs per module on staggered 1.50 mm x 1.75 mm pitch. Stack height aids airflow and accommodates misalignment.