High-Bandwidth Socket accommodates 0.65 mm pitch LGA ICs.

Press Release Summary:

Designed for 12 mm package size, XG-LGA-7000 Socket operates at bandwidths to 40 GHz with less than 1 dB of insertion loss. It dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed using elastomer with gold-plated, barbed pad connecting to IC Pad, socket offers characteristics such as 50 mW per pin (typ) contact resistance, 0.11 nH pin self-inductance, and 0.028 nH mutual inductance. Current capacity is 5 A/pin.

Original Press Release:

Extreme GHz Performance Socket for 0.65mm Pitch LGA 12x12x0.65 LGA IC

Ironwood Electronics has recently introduced the new high performance LGA socket for 0.65mm pitch LGA devices. The XG-LGA-7000 sockets are designed for a 12mm package size, operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 50 milliohms per pin.

The XG-LGA-7000 is constructed with high performance and low inductance elastomer with a gold plated, barbed pad connecting to the IC Pad. The temperature range is -40 C to +155 C. The pin self inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. The socket accommodates IC packages such as the 12X12 LGA with 0.65mm pads in a 17x17 array. Simply attach the socket to the PCB, drop in chip, place lid. Current capacity is 5 amps per pin. In addition the open lid option (XG-LGA-7001) allows probing of die or direct injection of heat or cooling air.

For further information and photo see:

Mike Fedde
Ironwood Electronics

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