Press Release Summary:
Housed in 3 x 3 x 0.7 mm package, Model UPG2253T6S combines power amplifier, low pass filter, and 2 SPDT switches into single chip. Device is suited for Bluetooth modules designed into notebooks, mobile phones, and headsets as well as ZigBee/802.15.4 modules used in automatic meter reading, wireless security, and lighting systems. Through/PA bypass feature enables end product to switch to high power mode when greater range is needed and low power mode when greater battery savings are optimal.
Original Press Release:
NEC's New Front End Integrated Circuit Simplifies Board Design and Reduces Cost
Small footprint enables new product designs
SANTA CLARA, Calif., July 13 / -- NEC is now shipping its UPG2253T6S Front End Integrated Circuit (FEIC), available through California Eastern Laboratories (CEL). The FEIC is a highly integrated device that combines a power amplifier (PA), low pass filter (LPF), and two single pole double throw switches (SPDT) into a single chip. By integrating these components into one die, the FEIC reduces component count, saves total bill of materials (BOM) cost, simplifies procurement, and decreases the printed circuit board (PCB) space required for many new embedded product designs. The FEIC eliminates the need for RF component matching which greatly simplifies board design and further reduces component count.
The FEIC is ideal for applications such as Bluetooth modules that are designed into notebooks, mobile phones, and headsets as well as ZigBee/ 802.15.4 modules which have wide applicability in automatic meter reading, wireless security, cable replacement, and lighting systems in both commercial and residential buildings. The FEIC significantly boosts range for CEL's extensive line of ZigBee/802.15.4 devices.
Leads the Market
The FEIC is superior to similar products on several fronts. Its smaller package size enables product designs with tiny footprints while its better harmonic suppression eliminates the need for low pass filters on most product designs. Few designs have the FEIC's through/PA bypass feature, which enables the end product to switch to a high power mode when greater range is needed but automatically switches to a low power mode when greater battery savings are optimal. Alternatively, the through/bypass path can be used as the Rx path. Furthermore, NEC's ability to integrate these functions on a single chip gives size reduction and performance advantages over companies using multi-chip modules.
"Our new FEIC enables many new product designs in Bluetooth, ZigBee, and other 2.4 GHz wireless applications. Interest has been strong from customers who have been sampling it, and no other company can deliver such a convenient, easy-to-design-in compact device, especially with NEC-level quality," said CEL Senior Product Line Manager Joe Grimm. "We will continue to improve the FEIC later this year and next," continued Grimm.
Package type: 12 pin QFN
Package size: 3 mm x 3 mm x 0.7 mm
DC: Vd = Ven = Vsm = 3.0V
Tx: Po = 19 dBm, PAE = 28%, Idd = 95 mA, 2f0 = -25 dBm, 3f0 = -40 dBm
Rx: Loss = 1.5 dB typical
Pricing and Availability
The UPG2253T6S FEIC is shipping now. Pricing is $1.10 in quantities of 100,000. Evaluation boards are available.
For more information on the FEIC, please visit: http://www.cel.com/parts.do?command=load&idRootPart=2085
Please contact David Cohen at firstname.lastname@example.org for more information or to arrange a detailed technical briefing.
California Eastern Laboratories (www.cel.com) is the exclusive sales and marketing partner for products made by the Compound Semiconductor Devices Division (CSDD) of NEC Electronics Corporation. NEC is world famous as a leader in manufacturing quality and reliability.
CONTACT: David Cohen, +1-408-919-2290, email@example.com
Web Site: http://www.cel.com/