Focused Ion Beam System provides circuit edit platform.
Press Release Summary:
Model V600FIB Focused Ion Beam system is offered for debug, failure analysis, and sample preparation for semiconductor devices down to 90 nm, with upgrade path for circuit edit applications for designs below 65 nm. With Sidewinder(TM) 30 kV ion column, application-specific gas delivery system, and 5-axis tilt stage for stable cross sectioning for failure analysis applications, system accommodates variety of samples, from packaged parts to 8 in. wafers.
Original Press Release:
FEI Launches New V600FIB System
Powerful FIB Platform for Design Debug, Failure Analysis and Sample Prep Is Designed to Bridge Applications From 130 nm to 65 nm and Beyond
HILLSBORO, Ore., July 6 / -- FEI Company (NASDAQ:FEIC) has released the V600FIB, an all-new focused ion beam (FIB) system designed to provide optimum flexibility for high-throughput applications including circuit modification, cross-sectioning, sample prep and failure analysis for semiconductor devices with designs down to 90 nm. The upgradeable platform of the V600FIB is designed to ultimately provide advanced circuit edit applications for designs below 65 nm, giving users the full range of capabilities they need today, and a cost-effective path for meeting future requirements.
The rapid time-to-data for defect analysis and shortened cycles for device debugging provided by FEI's FIB and DualBeam(TM) (FIB/SEM) tools help semiconductor manufacturers finalize chips designs and achieve full production ramps faster and more efficiently. The results are lower costs and accelerated time to market.
The V600FIB replaces FEI's FIB 200 which, with more than 200 systems installed worldwide, has earned a reputation for its reliability and versatility for mid-range, high-volume semiconductor lab applications. The platform joins FEI's VectraVision(TM), currently recognized as the most advanced circuit edit platform for sub-90 nm technology nodes.
The V600FIB features FEI's Sidewinder(TM) 30kV ion column, a versatile gas delivery system to suit specific application requirements, and a 5-axis tilt stage for stable site-specific cross sectioning for failure analysis applications. The system also accommodates a variety of samples from packaged parts to eight inch wafers.
The first V600FIB, the initial system available on the new platform, has already shipped to Philips Semiconductors in Nijmegen, the Netherlands. Philips semiconductors has long-standing experience with FEI lab tools and plans to use the V600FIB as a multiple-user, high throughput circuit edit FIB.
"The V600FIB will provide users with new levels of performance across multiple high-throughput applications," said Tony Edwards, vice president and general manager for FEI's NanoElectronics Laboratory Business. "With its designed-in upgradeability, the V600 FIB will give customers greater flexibility in planning and managing their equipment assets as they progress through rapidly shrinking design nodes."
About FEI
FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level and provide innovative solutions for customers working in NanoBiology, NanoResearch and NanoElectronics. FEI's solutions deliver ultra-high resolution and automation to speed the pace of product release and production cycles for semiconductor, data storage, and MEMS manufacturers.
With R&D centers in North America and Europe, and sales and service operations in more than 50 countries around the world, FEI is bringing the nanoscale within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of this century into reality. More information can be found on the FEI website at: www.fei.com.
Source: FEI Company
CONTACT: Dan Zenka, APR, Global Public Relations of FEI Company,
+1-503-726 2695, or dzenka@feico.com
Web site: http://www.feicompany.com/
