Press Release Summary:
Suited for semiconductors and transistors, EB-350-3LV exhibits stability at room temperature and accelerated curing at elevated temperatures. Single-component, low-viscosity epoxy encapsulant, with its flame out properties, will meet UL-94VO testing and has glass transition temperature of 140Â°C. Supplied in pint, quart, and gallons as well as 10 oz Semco cartridges, product withstands thermal shock when fully cured and offers continuous service up to 180Â°C.
Original Press Release:
One Component, Flame Retardant Epoxy
Epoxyset has developed a new, one component, low viscosity epoxy encapsulant, EB-350-3LV. EB-350-3LV is a unique formulation that has excellent stability at room temperature, but fast curing capability at elevated temperatures. With excellent flame out properties, EB-350-3LV will meet UL-94VO testing. The fully cured material can withstand extreme thermal shock and offers continuous service up to 180C. It is suited well for semiconductors and transistors.
EB-350-3LV has a high glass transition temperature of 140C and a low coefficient of thermal expansion. Packaging options vary from pint, quart, and gallons to 10oz Semco cartridges which is excellent for one component epoxies.