European Fab Installs Second Rudolph Inspection System to Meet 100-Percent Inspection Requirements of Automotive Industry

Fast, automated NSX tools become de facto standard

FLANDERS, NJ (August 14, 2007)- Rudolph Technologies, Inc. (NASDAQ: RTEC), the leading provider of process control systems for the semiconductor manufacturing industry, today announced its NSX® 115 automated macro defect inspection tool has been selected by a major European fab for outgoing quality assurance of semiconductor devices destined for automotive applications.

The selection was made after a rigorous competitive evaluation that focused on the speed, sensitivity, gauge capability and flexibility needed to meet the 100-percent inspection and zero-defect requirements now prevalent in the automotive industry. The availability of Rudolph's automatic defect classification, yield analysis and offline data review software, which can significantly improve the effective throughput of the tool, was also an important factor in the selection process.

This is the second NSX inspection system installed for outgoing quality control (OQA) at this site, and reinforces Rudolph's position as the de facto standard for 100-percent inspection required by automotive customers. Demand for fast, automated macro defect inspection is expected to increase as automotive manufacturers worldwide require 100-percent inspection from their semiconductor suppliers.

The NSX has proven to be highly effective as an OQA monitor, and equally important, as a source of critical data about defectivity rates and distributions that is simply unavailable with manual inspection," said Nathan Little, executive vice president and general manager of Rudolph's Inspection Business Unit. "In this situation, the most important consideration was high throughput. As this competitive win confirms, we believe the NSX 115 is the best available tool for the100-percent inspection needed to meet the zero-defect demands of the automotive sector. Rudolph intends to play an important supporting role in our customers' continuing success in this growing market.

The NSX Macro Defect Inspection System is a fast, repeatable inspection solution used throughout the semiconductor manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the performance and quality of a microelectronic device. The NSX quickly and accurately detects yield-inhibiting defects, providing quality assurance and valuable process information. Rudolph's automatic defect classification, defect review, and yield management software help manufacturers use this information more effectively to reduce manufacturing costs and accelerate time to market.

Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at

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