Epoxy System meets NASA low outgassing specfications.
Press Release Summary:
EP30-2 low viscosity, two-component system produces high strength bonds that are resistant to thermal cycling and chemicals. Resin system is 100% reactive and does not contain any solvents or other volatiles. Shrinkage upon cure is -0.0003in/in. Hardened resin provides electrical insulation. EP30-2 cures clear and is suitable for sealing, bonding, and laminating applications. Service operating temperature is -60 deg F to more than 250 deg F.Original Press Release:
Low Viscosity Epoxy System Meets NASA Low Outgassing Specifications
A new low viscosity, two component epoxy resin system called Master Bond EP30-2 has been introduced for high performance sealing, bonding and laminating applications. EP30-2 produces durable high strength bonds which are resistant to thermal cycling and chemicals. It has a service operating temperature range of -60°F to more than 250°F. It will cure at room temperature or more quickly at elevated temperatures.
Master Bond EP30-2 has a 100 to 10 mix ratio by weight. This resin system is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded
assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low -0.0003in/in. The hardened resin is an electrical insulator and EP30-2 cures clear. This resin fully meets the requirements of MIL R9300B and NASA low outgassing specifications.
For further information, please contact:
James Brenner
Marketing Manager
154 HOBART STREET HACKENSACK, NEW JERSEY 07601-3922 TEL: 201-343-8983 FAX: 201-343-2132 Visit our WEBSITE at http:/www.masterbond.com
