Press Release Summary:
Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative PhotoresistÂ is available in thickness formats from 5–50 Âµm, Â±5%. Film offersÂ glass transition temperature of 158Â°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25Â°C. Hydrophobic in nature, product can withstand harsh environments including extreme moisture conditions and corrosive chemicals once cured. DF-3010Â can be used in contact with EMS line of spin coatable photoresists.
Original Press Release:
Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist
DELAWARE, OH -- Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-3010 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3010 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3010 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.
DF-3010 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.
For more information about the DF-3010 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.