Photoresists

Dry Film Negative Photoresist suits MEMS/CMOS applications.
Photoresists

Dry Film Negative Photoresist suits MEMS/CMOS applications.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative PhotoresistÂ- is available in thickness formats from 5–50 µm, ±5%. Film offers glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C. Hydrophobic in nature, product can withstand harsh environments including extreme...

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Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
Photoresists

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...

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Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015
Photoresists

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

DELAWARE, OH - Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy. The DF-3000 series is available in various thickness formats from 5 to 50 Â-µm, ±5 percent. The...

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Negative Photoresist offers chemical and moisture resistance.
Photoresists

Negative Photoresist offers chemical and moisture resistance.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 Â-µm, ±5%. Cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. With glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa...

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Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015
Miscellaneous Film

Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015

DELAWARE, OHÂ- – Engineered Materials Systems (EMS), Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists. The DF-3000 series is available in various...

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Dry-Film Negative Photoresist suits MEMS, wafer applications.
Photoresists

Dry-Film Negative Photoresist suits MEMS, wafer applications.

Optimized for hot roll lamination and processing on micro electro mechanical systems (MEMS) and IC wafers, DF-3020 comes in thickness formats from 5–50 Â-µm, ±5%. Cured chemistry can withstand harsh environments, including extreme moisture and corrosive chemicals; glass transition temperature is 158°C; and moderate modulus is 3.5 GPa at 25°C. Suited for MEMS and...

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Dry Film Negative Photoresist produces hydrophobic surfaces.
Photoresists

Dry Film Negative Photoresist produces hydrophobic surfaces.

Optimized for hot roll lamination and processing on micro-electromechanical systems (MEMS) and IC wafers, DF-4017 produces hydrophobic (>90° contact angle) film surfaces. Cured chemistry withstands harsh environments, including those subject to moisture and corrosive chemicals, while glass transition temperature of 145°C andÂ- moderate modulus of 4.5 GPa at 25°C lend to...

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Photoresist Processing System suits high volume manufacturing.
Coating Equipment

Photoresist Processing System suits high volume manufacturing.

Intended for high-volume logic and memory manufacturing, 300 mm EVG®150XT features 9 process modules that can operate simultaneously for multi-parallel wafer processing. System incorporates smart scheduling software for throughput-optimized handling sequences, along with pumps and dispense systems tailored for thick film applications. With in-line metrology module, variety of process...

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Dry Film Negative Photoresist targets MEMS applications.
Photoresists

Dry Film Negative Photoresist targets MEMS applications.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 Â-µm thickness, ±1 µm and can be manufactured from 5–25 µm thick. Film features glass transition temperature of 165°C and moderate modulus of 4 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand...

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Dry Film Negative Photoresists withstand harsh environments.
Photoresists

Dry Film Negative Photoresists withstand harsh environments.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-2000 SeriesÂ- is available in thickness formats from 5–50 µm ±5%. Films feature glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments, including extreme moisture conditions and corrosive...

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