Bilayer Photoresist handles sub-65nm lithography.
Bilayer photoresist uses silicon polymer in imaging layer to optimize etch selectivity for addressing demands of sub-65nm lithography. Level of silicon content also eliminates need for separate hardmask layer and accompanying process steps. Photoresist exhibits no detectable levels of outgassing during lithography process, and etch selectivity lends to successful transfer of smaller circuit...
Read More »Dry Photoresists provide wafer bumping.
Series WB Photoresists offer alternative for wafer bumping versus liquid resists. Thick, dry photoresists, ranging from 50-100 microns, are applied in one step, with no solvents or drying required. Range of formulations are available for use in lead-free, photostencil, and standard electroplating applications.
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A True Game-Changer For Walk-In Unit Frame Performance
This white paper outlines the eight reasons why the FUSIONFRAME system is the superior thermal envelope system. Download now to find out more.
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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