New Photoresists Products

Dry Film Negative Photoresist suits MEMS/CMOS applications.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative Photoresist- is available in thickness formats from 5–50 -µm, -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

DELAWARE, OH - Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy. The DF-3000 series is available in various thickness formats from 5 to 50 -µm, -

Negative Photoresist offers chemical and moisture resistance.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 -µm, -

Choosing an Optimal Custom Label Printer: 5 Key Factors

Read about the 5 primary key factors you should consider when choosing an optimal label printer for your company.

Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015

DELAWARE, OH- – Engineered Materials Systems (EMS), Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists. The DF-3000 series is available in various...

Dry-Film Negative Photoresist suits MEMS, wafer applications.

Optimized for hot roll lamination and processing on micro electro mechanical systems (MEMS) and IC wafers, DF-3020 comes in thickness formats from 5–50 -µm, -

Dry Film Negative Photoresist produces hydrophobic surfaces.

Optimized for hot roll lamination and processing on micro-electromechanical systems (MEMS) and IC wafers, DF-4017 produces hydrophobic (>90-

Photoresist Processing System suits high volume manufacturing.

Intended for high-volume logic and memory manufacturing, 300 mm EVG-®150XT features 9 process modules that can operate simultaneously for multi-parallel wafer processing. System incorporates smart scheduling software for throughput-optimized handling sequences, along with pumps and dispense systems tailored for thick film applications. With in-line metrology module, variety of process...

Dry Film Negative Photoresist targets MEMS applications.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 -µm thickness, -

Dry Film Negative Photoresists withstand harsh environments.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-2000 Series- is available in thickness formats from 5–50 -µm -

Precision Machined Parts for High Tech Applications

For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.