Press Release Summary:
Electrically conductive Type 102-05F screen printable ink, coating and adhesive can be printed onto ribbon cables, flex circuits and other components to provide EMI/RFI shielding. It bonds to Indium Tin Oxide (ITO) sputtered surfaces and can be applied as bus bars onto ITO sputtered surfaces. It adheres to glass, mylar, kapton, ultem and other surfaces. Applications include EMI/RFI shielding, thick film circuits, and bus bars on touch panels.
Original Press Release:
Electrically Conductive, Shielding Ink 102-05F
DESCRIPTION: CMI's 102-05F is an electrically conductive, screen printable ink, coating and adhesive. This material can be printed onto ribbon cables, flex circuits and a variety of other components to provide EMI/RFI shielding. 102-05F also bonds extremely well to Indium Tin Oxide (ITO) sputtered surfaces and can be applied as bus bars onto ITO sputtered surfaces. CMI's 102-05F provides excellent adhesion to glass, Mylar, Kapton, Ultem and a variety of other surfaces, providing a flexible and abrasion resistant EMI/RFI shield. A sprayable concentrate version of 102-05F is available as CMI 105-43.
APPLICATIONS: Some applications for 102-05F include, but are not limited to:
* EMI/RFI shielding.
* Polymer thick film circuitry.
* Conductive bus bars on touch panels and electro luminescent panels.
o Membrane switches.
STRENGTHS OF PRODUCT:
102-05F is durable: 102-05F is both flexible and resistant to abrasion and scratching.
102-05F is practical: 102-05F can adhere to Indium Tin Oxide (ITO) and a wide variety of other surfaces.
102-05F is versatile: 102-05F can be mixed with a curing agent to increase resistance to solvents and high humidity and to promote curing at temperatures as low as 50ºC
DESCRIPTION: 102-05F is an electrically conductive ink, coating and adhesive suitable for screen printing very narrow circuit lines. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion and scratching. Some applications for 102-05F include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and for bonding to Indium Tin Oxide (ITO) sputtered surfaces. 102-05F can be further cross-linked with B187 curing agent for applications requiring resistance to solvents and high humidity. Refer to handling instructions for additional information.
TYPICAL CURED PROPERTIES:
Consistency Smooth Paste
Percent Silver (cured) 85
Crease Resistance Excellent
Volume Resistance (Q-cm) 0.00005
Sheet Resistivity (Q/sq./mil) 0.019
Solvent Resistance Excellent
Hydrolytic Stability Excellent
Useful Temperature Range (OC) -55 to 200 Thermal Stability Good to 325
Wet Coverage (in2/gm/mil) 28.0
Specific Gravity 2.52
SUGGESTED HANDLING & CURING: 102-05F is ready to use as supplied. Further thinning may be accomplished by adding small amounts of CMI Thinner #203 and/or butyl cellosolve acetate. Prior to using, be certain to resuspend silver. Best properties, for most applications, result when cured for 1 hour at 1750C. Good properties are obtained on a variety of substrates by curing at temperatures ranging from 500C to 1500C. NOTE: Add B187 catalyst when using low temperature cures. The use of B187 is suggested to impart a high degree of chemical resistance to the conductive lines. End user is advised to experimentally determine temperature and time best suited for individual applications. STORAGE: Shelf life: 4 months at 25°C; or 6 months at 5°C; or 12 months at -100C.
SAFETY & HANDLING: Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove from skin. All technical in formation reliable. No warranty particular application or is based on data obtained by CMI personnel and is believed to be is either expressed or implied with respect to suitability in a possible infringements on patents.