Press Release Summary:
QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150Â°C. This product can perform in lead-free, 260Â°C reflow applications. Hydrophobic, and stable at high temperatures, QMI 526 delivers void-free bond lines with excellent adhesive strength on organic and metal surfaces. Its adhesion mechanism compensates for fluorine and backside residue presence.
Original Press Release:
Dexter Introduces 260*C Reflow Silver-Filled Conductive Adhesive
Dexter Electronic Materials, a division of Loctite Corporation, has introduced new QMI 526, a silver-filled thermally conductive adhesive used to attach integrated circuits and components to advanced substrates including PBGAs, CSPs, stacked die, and array packages based on flexible tape and organic laminates. This low stress material is designed for use with large die (>500 mil) or for applications where the substrates' coefficients of thermal expansion (CTE) differ substantially. This product is qualified to perform in lead-free, 260°C reflow applications.
Thermally conductive, hydrophobic, and stable at high temperatures, QMI 526 delivers void-free bond lines with excellent adhesive strength on a wide variety of organic and metal surfaces including solder mask, BT, FR, polyimide, gold, Kapton(TM), and Mylar(TM). QMI 526 offers a robust adhesion mechanism that can compensate for the presence of fluorine or
other backside residues, for example on wafers. The adhesive-also offers excellent electrical properties.
Designed to achieve UPHs substantially higher than conventional oven cures, QMI 526 is formulated to cure in-line, either on the diebonder using a post-diebond heater or on the wirebonder preheater. QMI 526 can be cured in-line using Skip-Cure(TM) processing in just 8 seconds at 150°C, or using a variety of times and temperatures in conventional ovens or snap cure stations.