Clear Shape's Variability-Aware DFM Products are Finalists for 3 Industry Awards
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Recognized by EDN Innovations, EE Times ACE, and Top Semiconductor Company Partner Awards
SANTA CLARA, Calif., March 21 -- Clear Shape Technologies, Inc., a leader in variability-aware analysis and optimization solutions, today announced that their variability platform products have been nominated for three EDA industry awards: the EDN Innovation of the Year Award; the EE Times Annual Creativity in Electronics (ACE) Award; and one of the top 10 semiconductor companies' Partner Award.
InShape(TM) achieved finalist standing in the EDN Innovation Award category for IC back-end/Design for Manufacturing (DFM)/proprietary ASIC and FPGA flows. InShape is the first model-based full-chip Design Manufacturability Checker that predicts accurate silicon shapes, providing designers the ability to do fast, accurate DFM hotspot detection of catastrophic failures. Additionally, InShape produces critical dimension (CD) reports which are a required input for fast and accurate eDFM analysis and optimization across process window.
Clear Shape was also chosen as finalist for the EE Times ACE Awards Design Team of the Year for its efforts on OutPerform(TM), a comprehensive electrical DFM variability analysis and optimization solution. OutPerform uses the silicon contours predicted by InShape and performs device extraction to compute the difference in timing and leakage power, as well as RC-extraction of interconnect to calculate the change in timing and noise at the full-chip level. Using this variability-aware analysis and optimization, designers can prevent catastrophic and parametric failures across process window to save expensive re-spins and lost revenues.
Clear Shape's Variability Platform was selected as finalist for one of the top 10 semiconductor companies' Partner Award. Clear Shape's Variability Platform includes two products, InShape and OutPerform, and allows designers to analyze and optimize the parametric and catastrophic impact of systematic manufacturing variations. It utilizes innovative, patented model-based technology which contains secure fab data to capture RET, OPC, CMP, mask, etch and lithography effects on both device and interconnect.
"Clear Shape is offering the first real DFM tool. It's the first one targeted for the designer. All the rest have been post-GDSII tools," stated Gary Smith, founder and chief analyst of Gary Smith EDA.
"Clear Shape is the only design-technology / DFM company that has been nominated for three of the most prestigious awards in our industry," said Nitin Deo, vice president of marketing and business development for Clear Shape. "We are pleased to see that our innovative solutions are being recognized by our peers," he added.
About the EDN Innovation Awards
The annual EDN Innovation Awards honor outstanding engineering professionals and recognize unique, state-of-the-art electronics products in several categories. EDN uses a combination of audience online votes, balloting by the EDN Editorial Advisory Board, and voting by EDN's editorial staff to determine the ultimate winners. EDN will present the awards at a ceremony held on April 2, 2007 in San Jose.
About the EE Times ACE Awards
The EE Times ACE Awards celebrate the creators of technology who demonstrate leadership and innovation in the global industry and shape the world. The creators and their innovations will be recognized at the EE Times ACE Awards Gala on April 3, 2007 as part of CMP Technology's Embedded Systems Conference Silicon Valley, the largest electronic systems design event in North America.
About Clear Shape
Clear Shape Technologies, Inc. is focused on delivering a complete Variability Platform that allows designers to control and optimize the parametric and catastrophic impact of systematic manufacturing variations. Clear Shape products are targeted to cell-based, custom analog, IP, and library designers using sub-90 nm processes. Clear Shape's products utilize innovative, patented model-based technology which contains secure fab data to capture RET, OPC, CMP, mask, etch and lithography effects on both device and interconnect. Clear Shape's products are in the DFM qualification programs of all three major foundry platforms. Clear Shape is backed by top-tier venture investors that include USVP, Intel Capital and KT Ventures (KLA Tencor). The company is headquartered at 3255-3 Scott Blvd. Suite 102, Santa Clara, Calif. 95054. For more information, visit www.clearshape.com or call +1 (408) 833- 7130.
Source: Clear Shape Technologies, Inc.
CONTACT:
Gloria Nichols
Launch Marketing
+1-650-851-6919
gloria@launchm.com
for Clear Shape Technologies, Inc.
Web site: www.clearshape.com/
http://www.embedded.com/esc/sv
