Chip Assembler suits high-speed applications.
Press Release Summary:
Siplace S-27 HM placement machine assembles products containing typical SMD components and bare chips with max output of 26,500 components/hour and ±60 µm precision and reliability. Machine can be adapted and expanded to meet specific requirements of chip assembly for unique applications. Unit is equipped with 2 gantries and 2 independently working placement heads. Offerings include wafer feeders, surf tape feeder, and tray-stack feeder for 2 and 4 in. trays.
Original Press Release:
Siplace S-27 HM Now Also Specifically for High-Speed Chip Assembly
Siemens Dematic Electronics Assembly Systems, Munich, is offering a special machine configuration based on the new Siplace S-27 HM for high-speed chip assembly. This placement machine is particularly suitable for products containing both typical SMD components and bare chips-for COB as well as flip-chip technologies, and which are produced in larger quantities. The Siplace S-27 HM has been optimally designed for this specific placement task, both in respect of the investment and the space it requires. No single machine can yet place the entire range of components in this segment. This minimizes placement costs. The Siplace automatic machine is optimally configured to suit the product. This applies not only to the placement heads, cameras and printed circuit board transport but also to all types of component feeders.
The Siplace Chip Assembler handles not only standard SMDs (surface mounted devices) but also the wide range of advanced packages at a maximum output of up to 26,500 components per hour, quickly and with the greatest precision and reliability (± 60 µm/4 sigma).
The particularly preferred fields of application are the production of high volumes of modules for bluetooth, HF (high frequency), memory and disk-drive applications, and controllers for automobile electronics. This is where the Siplace Chip Assembler can exploit all its advantages. All the components needed to manufacture these and similar products can be optimally placed with the Siplace S-27 HM machine. This machine can be adapted and expanded to meet the specific requirements of chip assembly. For example, it has a multitude of options for component feeding, handling printed circuit boards and ceramic substrates, or vision modules for placing the smallest components with the greatest reliability. This high-speed automatic production machine is equipped with two gantries and two independently working placement heads. The placement heads and the associated vision modules can be optimally and precisely configured to meet individual customer requirements for the products to be manufactured.
The uniform modular concept of the Siplace platform enables production lines to be quickly adapted to new products. Users also benefit from the great advantages of the global "Service&Support" network, and the compatibility across several machine generations which provides a long-term safeguard for investments. The customer receives a high level of Siplace Service&Support, which has been tried and tested worldwide, for every chip assembler application.
Background information:
In electronics manufacturing, all types of advanced packages-such as bare dies as chip-on-board (COB), flip-chip and chip scale packages (CSP)-are being used to an increasing extent in modules and submodules. The smallest, current, passive components, with a edge length of 0.6x0.3mm (0201), are increasingly being used, particularly in submodules.
The following expansions designed specifically for chip assembly applications are available for the Siplace S-27 HM:
- Component sensor for reliable placement of the smallest bare dies and 0201 components
- Wafer feeders including optional flip unit for fast supply of bare dies directly from the sawn wafer
- Surf tape feeder for supplying already separated bare dies from adhesive tape
- Tray stack feeder for 2 and 4 inch trays
- Component feeding with bulk feeders, vibratory stick feeders, matrix-tray changers (MTC) and application-specific feeders
- Dip module for applying flux or electrically conductive adhesive to CSPs and flip-chips
- Configuration for rational and reliable reel-to-reel handling of flexible substrates
- Centering device for ceramic substrates to ensure gentle transport, clamping and placement of these substrates.
Dies are handled as COBs or flip-chips and similar components ranging in size from 1.0x1.0mm to 13x13mm (however, even smaller dies are possible). The dimensions for standard SMDs range from 0.6x0.3mm (0201 components) to 19x19mm. Larger components up to 32x32mm can be placed with the 6-segment Collect&Place head.
The very high placement rate is achieved by means of two independently operating Collect&Place heads. The standard fitting is a twelve-nozzle head which is suitable for formats up to 13x13mm. The six-nozzle head can handle larger components up to 32x32mm. The tried and tested Siplace modular heads provide the option of installing the head configuration and associated vision modules suitable for a specific range of components and customer requirements.
Substrates in formats ranging from 50x50mm to 495x460mm (2x2 to 19.5x18 inches) can be handled with single transport. The double transport moves substrates ranging in size from 50x50mm to 495x216mm, that is 2x2 to 19.5x8.5 inches. The "long printed circuit board" option enables printed circuit boards up to 610mm in length to be handled by single and double transport.
Siemens Dematic AG, based in Nuremberg/Germany, is the world's leading supplier of logistics and factory automation equipment. As a systems integrator, Siemens Dematic supplies the whole range of products and services, from individual products and systems right up to complete turnkey facilities as a general contractor. Siemens Dematic AG consists of three divisions: Electronics Assembly Systems, Material Handling Automation and Postal Automation. The company, with some 11,000 employees worldwide, has a business volume of around 3 billion euros. More information about Siemens Dematic can be found under www.siemens-dematic.com
For further information: www.siplace.com.
Siemens Dematic Electronics Assembly Systems, Munich, is offering a special machine configuration based on the new Siplace S-27 HM for high-speed chip assembly. The Siplace automatic machine is optimally configured to suit the product. This applies not only to the placement heads, cameras and printed circuit board transport but also to all types of component feeders.
You can access the photo in the Internet at: http://siemens.com/sd-picture/sd0303152p
You will find this press release in the Internet under: presse.siemens-dematic.de
Please send reader inquiries under reference number "SD 0302.152" to:
Siemens Dematic AG
Electronics Assembly Systems
Susanne Oswald
Email: susanne.oswald@siemens.com
Internet: www.siplace.com
